Abstract—Defects on semiconductor wafers are not uniformly distributed, but tend to cluster. These spatial defect patterns contain useful information about issues during integrated circuit fabrication. Promptly detecting abnormal wafers is an important way to increase yield and product quality. However, research on identifying spatial defect patterns has focused only on flash memory with a s…
Abstract In semiconductor manufacturing processes, monitoring the quality of wafers is one of the most important steps to quickly detect process faults and significantly reduce yield loss. Fail bit maps (FBMs) represent the failed cell count during wafer functional tests and have been popularly used as one of the diagnosis tools in semiconductor manufacturing for process monitoring, root caus…