Regression Analysis of Low Kill Potential Defect Mechanisms (Moving Beyond Co…

Abstract—A means of measuring the yield influence for high density, low kill potential defect mechanisms is presented. The method can be applied to wafers individually and is only, marginally more expensive to implement than a least squares fit, but has a much smaller standard error and provides a clear indicator of impact on yield. The ability to tolerate up to 50% outliers enables the metho…