e-journal

Preparation of poly(vinyl chloride)/copper nanocomposite films with reduced bacterial adhesion

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Films of poly(vinyl chloride)/copper (Cu) nanocomposites exhibiting reduced bacterial adhesion were prepared by film-casting method. Cu nanoparticles (NPs) synthesized using polyol method and stabilized with poly(N-vinyl-2-pyrrolidone) (PVP) at different Cu/PVP molar ratio were previously characterized using transmission electron microscopy (TEM), X-ray diffraction (XRD) and ultraviolet–visible spectroscopy. Zero valent Cu NPs with average diameter of 4 nm were obtained. The nanocomposite films with low and high Cu content were prepared with Cu NPs obtained from
Cu/PVP molar ratio of 7.2, 45 and 270. XRD patterns of PVC/Cu nanocomposite films did not show peaks associated at copper oxide and other impurities. Scanning electron microscopy (SEM) and X-ray energy dispersive spectroscopy Cu-mapping revealed a homogenous distribution of Cu NPs agglomerates in nanocomposite films prepared with Cu NPs obtained from Cu/PVP ratio of 7.2 and high Cu content, while TEM images of this nanocomposite film with low Cu content showed well-dispersed and distributed Cu NPs in PVC matrix. The films prepared with Cu NPs obtained from Cu/PVP ratio
of 270 showed a vertical phase separation, where PVP was segregated to the free surface. SEM images revealed a reduced Escherichia coli adhesion to PVC/Cu nanocomposite films after 4 days of incubation with respect to plasticized PVC.

Keywords PVC/Cu nanocomposite, copper nanoparticles, film-casting and bacterial adhesion

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Informasi Detail

Judul Seri

High Performance Polymers

No. Panggil

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Penerbit

: SAGE Publications Ltd., 2012

Deskripsi Fisik

High Performance Polymers 25(1) 51–60 ª The Author(s) 2012

Bahasa

English

ISBN/ISSN

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Klasifikasi

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Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

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Subjek

BIOKIMIA

Info Detail Spesifik

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Pernyataan Tanggungjawab

hasnidar/agus

Versi lain/terkait

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