e-book
Engineering Properties of Foods
We are pleased to present the third edition of Engineering Properties of Foods.
The third edition is comprehensive, with seven new chapters: Mass–Volume–
Area-Related Properties of Foods, Properties Relevant to Infrared Heating of
Foods, Electrical Conductivity of Foods, Ultrasound Properties, Kinetic Data
for Biochemical and Microbiological Processes during Thermal Processing, Gas
Exchange Properties of Fruits and Vegetables, and Surface Properties. Two of
the previous chapters, Thermal Properties and Dielectric Properties, have been
completely rewritten. Thus, 9 out of 16 chapters are new. We have systematically
searched and included physical, chemical, and biological properties that
are of practical importance and for which significant data exist.
We have added Professor Ashim Datta as a co-editor to help with this
rather large undertaking. In looking for experts on topics, we have also made
an effort to expand the international participation of authors. We have added
authors/co-authors from four additional countries. We have made a special
effort to follow a consistent format for the chapters so that readers can follow
it easily. Thus, chapters include an introduction, property definition, measurement
procedure, modeling, representative data compilation, and applications.
We have concentrated on clear physical understanding of the properties
and their variations, supplemented by representative and sufficient data,
staying away from extensive data collection, for which electronic formats are
likely to be more suitable. By providing a succinct presentation of each property
in a consistent format, we hope to make it useful to the student as well
as the professional. As computer-aided engineering (modeling) is becoming
more commonplace, the primary use of food properties data is expected to be
in computer modeling of food processes. Data correlations with compositions
and temperature are particularly useful in this context since they will allow
easy inclusion of variable properties in computer models. We have included
such correlations as much as possible.
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