Gaya APA

[et.al], R, B. (2015). Microstructural characterization of Si wafers processed by multi-wire sawing of hot pressed silicon powder based ingots . : WILEYVCH Verlag GmbH & Co. KGaA.

Gaya MLA

[et.al], Rajko, Buchwald. "Microstructural characterization of Si wafers processed by multi-wire sawing of hot pressed silicon powder based ingots". : WILEYVCH Verlag GmbH & Co. KGaA, 2015. e-journal.