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Microstructural characterization of Si wafers processed by multi-wire sawing of hot pressed silicon powder based ingots

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The purpose of this work is to verify the possibility to process highly doped Si supporting substrates using a 2-step process:(i) sintering of a low-cost Si powder based ingot using hot pressing and a ELKEM Silgrain material as a feedstock; and (ii) wafering of such ingots using multi-wire sawing technique similar to that, which is used for cast multi-Si or Cz-Si grown ingots. Moreover, the possibility to dope Si powder ingot at sintering temperatures below melting point of Si, using a mixture of Si and boron powders to fabricate highly conductive Si wafers is verified as well. The slurry technique has been chosen for multi-wire sawing of sintered Si powder based ingots. Surface properties of Si powder based substrates as well as their chemical composition have been studied by optical microscopy imaging and energydispersive X-ray spectroscopy (EDX). Although the overall concentrations of oxygen, carbon and possibly also metal impurities, which are initially present in a low-cost Si feedstock, are too high to achieve acceptable semiconducting properties, it is concluded, that sintered Si powder based wafers have high enough conductivity (resistivity 0.001Vcm) to serve as supporting substrates for low cost Si wafer equivalent structures.

Keywords hot pressing, powders, silicon, slurry sawing, wafering, wafers

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Informasi Detail

Judul Seri

Phys. Status Solidi

No. Panggil

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Penerbit

: WILEYVCH Verlag GmbH & Co. KGaA., 2015

Deskripsi Fisik

Phys. Status Solidi A 212, No. 1, 25–29 (2015)

Bahasa

English

ISBN/ISSN

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Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

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Subjek

FISIKA

Info Detail Spesifik

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Pernyataan Tanggungjawab

Wati/Agus

Versi lain/terkait

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