e-journal

Adaptive Virtual Metrology Design for Semiconductor Dry Etching Process Through Locally Weighted Partial Least Squares

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Abstract
In semiconductor manufacturing processes, virtual metrology (VM) has been investigated as a promising tool to predict important characteristics of products. Although partial least squares (PLS) is a well-known modeling technique that can cope with collinearity and therefore applied to construction of
VM, its prediction performance deteriorates due to changes in process characteristics. In particular, maintenance of equipment strongly affects the process characteristics and the prediction performance. In this paper, VM was developed by using locally weighted PLS (LW-PLS), which is a type of just-in-time modeling technique, and it was used to predict the etching conversion differential of an actual dry etching process. The industrial application results have shown that the developed VM based on LW-PLS is superior to the conventional VM based on the sequential update model and artificial neural network model. In particular, it has been confirmed that the LW-PLS-based VM can keep its high prediction performance even after the maintenance, i.e., replacement of parts.

Index Terms—Equipment engineering system (EES), just-in-time (JIT) modeling, locally weighted regression (LWR), semiconductor process, virtual metrology (VM).

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Informasi Detail

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 2, MAY 2015

No. Panggil

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Penerbit

: IEEE., 2015

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 2, MAY 2015

Bahasa

English

ISBN/ISSN

0894-6507

Klasifikasi

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Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

VOL. 28, NO. 2, MAY 2015

Subjek

SEMIKONDUKTOR
METROLOGI VIRTUAL
SISTEM REKAYASA PERALATAN

Info Detail Spesifik

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Pernyataan Tanggungjawab

ETY

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