Gaya APA

al.], M, J, [. (2014). Improvement of Electrochemical Migration Resistance by Cu/Sn Intermetallic Compound Barrier on Cu in Printed Circuit Board (VOL. 14, NO. 1, MARCH 2014). New York: IEEE.

Gaya MLA

al.], Min-Suk, Jung, [et. "Improvement of Electrochemical Migration Resistance by Cu/Sn Intermetallic Compound Barrier on Cu in Printed Circuit Board". VOL. 14, NO. 1, MARCH 2014 New York: IEEE, 2014. e-journal.