Gaya APA

Wu, L., Yan, C. (2015). Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP (VOL. 28, NO. 1, FEBRUARY 2015). : IEEE.

Gaya MLA

Wu, Lixiao., Yan, Changfeng. "Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP". VOL. 28, NO. 1, FEBRUARY 2015 : IEEE, 2015. e-journal.