Gaya APA

Luo, J., Dornfeld, D, A. (2001). Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling (VOL. 14, NO. 2, MAY 2001). : IEEE.

Gaya MLA

Luo, Jianfeng., Dornfeld, David, A.. "Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling". VOL. 14, NO. 2, MAY 2001 : IEEE, 2001. e-journal.