Gaya APA

Teh, W, H. et al (2015). Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation (VOL. 28, NO. 3, AUGUST 2015). : IEEE.

Gaya MLA

Teh, Weng, Hong. et al. "Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation". VOL. 28, NO. 3, AUGUST 2015 : IEEE, 2015. e-journal.