e-journal

Scheduling and Analysis of Start-Up Transient Processes for Dual-Arm Cluster Tools With Wafer Revisiting

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Abstract—The trends of increasing wafer diameter and smaller lot sizes have led to more transient periods in wafer fabrication. For some wafer fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a so-called revisiting process. Most previous studies on cluster tool scheduling focus on steady state at which cluster tools repeat identical cycles. Research on transient processes of dual-arm cluster
tools with wafer revisiting processes becomes urgently needed for high-performance wafer fabrication. In order to speed up start-up transient processes, this paper adopts a program evaluation and review technique for the analysis of start-up transient processes and develops optimization algorithms for their scheduling of dual-arm cluster tools. Then, their complexity is analyzed. Finally, illustrative examples are given to show the applications of the proposed method.

Index Terms—Semiconductor manufacturing, transient process scheduling, revising process, cluster tools.

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Informasi Detail

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 2, MAY 2015

No. Panggil

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Penerbit

: IEEE., 2015

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 2, MAY 2015

Bahasa

English

ISBN/ISSN

0894-6507

Klasifikasi

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Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

VOL. 28, NO. 2, MAY 2015

Subjek

SEMIKONDUKTOR

Info Detail Spesifik

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Pernyataan Tanggungjawab

ETY

Versi lain/terkait

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