Gaya APA

Xu, Z., Lu, J. (2013). Through-Silicon-Via Fabrication Technologies, Passives Extraction, and Electrical Modeling for 3-D Integration/Packaging (VOL. 26, NO. 1, FEBRUARY 2013). : IEEE.

Gaya MLA

Xu, Zheng., Lu, Jian-Qiang. "Through-Silicon-Via Fabrication Technologies, Passives Extraction, and Electrical Modeling for 3-D Integration/Packaging". VOL. 26, NO. 1, FEBRUARY 2013 : IEEE, 2013. e-journal.