e-journal

Yield Prediction Through the Event Sequence Analysis of the Die Attach Process

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Abstract—Die attach is the process of mounting a plurality of dice to a printed circuit board (PCB) or substrate. Die attach is critical to the thermal and electrical performance of semiconductor products, significantly affecting the final yield of PCBs. In general, the die attacher records alarm events, change events, and maintenance events in a log. Alarm events occur when dice are not aligned well to the mounting positions on a PCB. Change events are recorded when product types are changed or raw materials of different suppliers are introduced. Maintenance events are recorded whenever the workers conduct corrective actions due to alarm events. We empirically observed that different sequences of events have different effects on the final yield. In this paper, we propose a data mining approach
that predicts the final yield of a PCB using the event sequences recorded in the log of the die attacher. We propose a predictive association rule considering the event sequence (PARCOS) algorithm that creates a set of rules, in which each rule estimates the yield for a sequence of events. An experiment with a work-site dataset demonstrated that the PARCOS algorithm had a yield prediction accuracy that was at least 9% higher than those of the regression models that did not consider the event
sequences.

Index Terms—Packaging process, yield prediction, die attach, event sequences, predictive association rule mining

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Informasi Detail

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015

No. Panggil

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Penerbit

: IEEE., 2015

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015

Bahasa

English

ISBN/ISSN

0894-6507

Klasifikasi

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Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

VOL. 28, NO. 4, NOVEMBER 2015

Subjek

SEMIKONDUKTOR

Info Detail Spesifik

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Pernyataan Tanggungjawab

ETY

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