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Bimaterial Cantilever Focal Plane Array for Uncooled Infrared Imaging Using Sandwich-Framed Structure

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Abstract—This paper reports a novel infrared focal plane array (FPA) using SiNx/SiO2/SiNx sandwiched structure as the supporting frames for bimaterial cantilever pixels. The device was fabricated by a bulk silicon process, where a trench backfill technique was employed to form the SiNx/SiO2/SiNx sandwiched frames. By replacing the silicon frame with SiNx/SiO2/SiNx sandwiched frame, the fill factor of the FPA is increased to 42%. Compared with other substrate-free FPAs with frames making of a thin layer of SiNx, the sandwiched frame provides more supporting strength for the cantilever pixels. Meanwhile, the reliability and the uniformity of the FPA were improved with a design of staggered arrangement of cantilever pixels. Thermal images of human bodies were captured successfully at room
temperature. A complete analysis of device performance was also carried out both theoretically and experimentally, including thermomechanical sensitivity, noise equivalent temperature difference, and response time. [2015-0261]

Index Terms—Focal plane array (FPA), infrared (IR) imaging, sandwiched frame, trench backfill technique

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Informasi Detail

Judul Seri

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

No. Panggil

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Penerbit

: IEEE., 2016

Deskripsi Fisik

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Bahasa

English

ISBN/ISSN

1057-7157

Klasifikasi

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Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

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Subjek

MIKROELEKTROMEKANIKAL

Info Detail Spesifik

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Pernyataan Tanggungjawab

ETY

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