Gaya APA

Froemel, J. et al (2015). Low-Temperature Wafer Bonding Using Solid–Liquid Inter-Diffusion Mechanism (VOL. 24, NO. 6, DECEMBER 2015). : IEEE.

Gaya MLA

Froemel, Joerg. et al. "Low-Temperature Wafer Bonding Using Solid–Liquid Inter-Diffusion Mechanism". VOL. 24, NO. 6, DECEMBER 2015 : IEEE, 2015. e-journal.