e-journal

Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring

---

The microelectronic packaging field is moving into the third dimension for miniaturization, low power consumption, and better performance. In this paper, we present a double-sided flip-chip (FC) organic substrate with a memory controller on one side of the package and 3-D stacked disaggregated memory chips
on the other side of the package. This design allows the controller to interface with the DRAM stack directly through the substrate providing the shortest possible interconnect path and thus achieving the fastest signaling speed. However, this double-sided FC configuration also causes yield, assembly, test, and reliability challenges. In order to optimize the assembly process, elastic and viscoelastic sequential 3-D finite-element models are developed to simulate the package assembly process and are validated experimentally. In these simulations, various assembly process sequences are simulated with different conditions.
Index Terms—Assembly, double-sided flip-chip, electronic packaging, finite-element modeling, warpage.

---

Ketersediaan

Tidak ada salinan data

Informasi Detail

Judul Seri

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

No. Panggil

-

Penerbit

New York : IEEE., 2014

Deskripsi Fisik

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 14, NO. 1, MARCH 2014

Bahasa

English

ISBN/ISSN

1530-4388

Klasifikasi

-

Tipe Isi

-

Tipe Media

-

Tipe Pembawa

-

Edisi

VOL. 14, NO. 1, MARCH 2

Subjek

TEKNIK

Info Detail Spesifik

-

Pernyataan Tanggungjawab

Yuli/Agus

Versi lain/terkait

Lampiran Berkas

Komentar

---

Anda harus masuk sebelum memberikan komentar