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Penanda Bagikan

e-journal

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

Vadimas Verdingovas - Nama Orang; Morten Stendahl Jellesen - Nama Orang; Rajan Ambat - Nama Orang;

The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured using single components (size 0805) and surface insulation resistance comb patterns precontaminated with sodium chloride at levels adjacent to levels used in the IPC J-STD-001 standard. The potential
bias of 5–10 V was applied during experiments, and the climatic conditions were in the range 60%–98% RH and 15 ◦C–65 ◦C. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition in the chamber.
A considerable increase in LC was observed at sodium chloride concentrations above 1.56 μg · cm−2, as the RH on the surface was close to the critical RH for sodium chloride. Prolonged exposure to conditions close to condensation resulted in the formation of tin whiskers and hillocks growing from the component electrodes due to corrosion of the electrodes freeing the whisker growth.
Index Terms—Ionic contamination, leakage current (LC),corrosion, reliability.


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Informasi Detail
Judul Seri
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
No. Panggil
-
Penerbit
New York : IEEE., 2014
Deskripsi Fisik
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 14, NO. 1, MARCH 2014
Bahasa
English
ISBN/ISSN
1530-4388
Klasifikasi
-
Tipe Isi
-
Tipe Media
-
Tipe Pembawa
-
Edisi
VOL. 14, NO. 1, MARCH 2014
Subjek
TEKNIK
Info Detail Spesifik
-
Pernyataan Tanggungjawab
Yuli/Agus
Versi lain/terkait

Tidak tersedia versi lain

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  • FULL TEXT. Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies
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