Performance analysis of Arithmetic Mean method in determining peak junction temperature of semiconductor device

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Performance analysis of Arithmetic Mean method in determining peak junction temperature of semiconductor device

Mohana Sundaram Muthuvalu [et al.] - Nama Orang;

High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The reliability of a semiconductor is determined by junction temperature. This paper gives a useful analysis on mathematical approach which can be implemented to predict temperature of a silicon die. The problem could be modeled as heat conduction equation. In this study, numerical approach based on implicit scheme and Arithmetic Mean (AM) iterative method will be applied to solve the governing
heat conduction equation. Numerical results are also included in order to assert the effectiveness of the proposed technique.

KEYWORDS
Peak junction temperature;Finite-difference method;Arithmetic Mean method;Performance analysis

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Judul Seri: Ain Shams Engineering Journal
No. Panggil: -
Penerbit: : Elsevier., 2015
Deskripsi Fisik: Ain Shams Engineering Journal (2015) 6, 1203–1210
Bahasa: English
ISBN/ISSN: -
Klasifikasi: -
Tipe Isi: -
Tipe Media: -
Tipe Pembawa: -
Edisi: -
Subjek: KIMIA
Info Detail Spesifik: -
Pernyataan Tanggungjawab: Wati/Agus

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FULL TEXT:Performance analysis of Arithmetic Mean method in determining peak junction temperature of semiconductor device

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