Ditapis dengan
Wafer Surface Charging Model for Single-Wafer Wet-Spin Processes
Abstract—Wet chemical processes in integrated circuit (IC) manufacturing are used in many applications, e.g., post-etch residue removal and pre-deposition surface treatment. While advanced single-wafer wet spin tools are part of the critical toolset for advanced IC fabrication, non-optimized tool hardware and/or process may induce different types of wafer surface charging issues. In this pap…
- Edisi
- VOL. 24, NO. 4, NOVEMBER 2011
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 24, NO. 4, NOVEMBER 2011
- Judul Seri
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 24, NO. 4, NOVEMBER 2011
- No. Panggil
- -
SiO2 Etching with Aqueous HF: Design and Development of a Laboratory-Scale In…
Abstract—Etching of SiO2 films using aqueous HF-based chemistries is widely used in integrated circuit and microelectromechanical device industries. To precisely control film loss during cleaning or etching processes, good control over the contact time between the wet chemistry and the substrate is necessary. An integrated wet etch and dry reactor system has been designed and fabricated by s…
- Edisi
- VOL. 24, NO. 1, FEBRUARY 2011
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 24, NO. 1, FEBRUARY 2011
- Judul Seri
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 24, NO. 1, FEBRUARY 2011
- No. Panggil
- -
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