Wafer Surface Charging Model for Single-Wafer Wet-Spin Processes

Abstract—Wet chemical processes in integrated circuit (IC) manufacturing are used in many applications, e.g., post-etch residue removal and pre-deposition surface treatment. While advanced single-wafer wet spin tools are part of the critical toolset for advanced IC fabrication, non-optimized tool hardware and/or process may induce different types of wafer surface charging issues. In this pap…