Ditapis dengan
Improvement of Rough Interface Between Barrier/Seed Layer and Porous Ultralow…
Abstract With critical dimension of device scaled down to 28 nm technological node and beyond, porous ultralow k (PULK) film as an insulator is used in Cu interconnects to further reduce resistance–capacitance (RC) delay. The integration of the PULK film faces more severe challenges due to the presence of porosity. Plasma treatments and wet cleaning processes have been considered to be cri…
- Edisi
- VOL. 29, NO. 1, FEBRUARY 2016
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
- Judul Seri
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
- No. Panggil
- -
Structural and morphological transformations of Zn–Al layered double hydrox…
Abstract. The Zn–Al layered double hydroxides (LDH) with Zn/Al molar ratio of 2 were prepared by coprecipitation, followed by hydrothermal treatment at various hydrothermal conditions. The phase transformation was observed, accompanied by drastical morphological changes. As the results indicated, in aqueous system the decomposition product was phase segregated into wurtzite ZnO and spinel…
- Edisi
- -
- ISBN/ISSN
- -
- Deskripsi Fisik
- Applied Surface Science 255 (2009) 6372–6377
- Judul Seri
- Applied Surface Science
- No. Panggil
- -
Research on micro-structure and hemo-compatibility of the artificial heart va…
Abstract. In order to seek the method to improve the hemo-compatibility of artificial mechanical heart valve, the surface of rabbit’s heart valve was observed using the scanning electron microscopy (SEM). The results showed that the dual-scale structure which consists of cobblestones-like structure of 8 umin underside diameter and 3 um in height, and the fine cilia of about 150 nm in diam…
- Edisi
- -
- ISBN/ISSN
- -
- Deskripsi Fisik
- Applied Surface Science 255 (2009) 6686–6690
- Judul Seri
- Applied Surface Science
- No. Panggil
- -
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