Ditapis dengan

  • Tahun Penerbitan
  • Ketersediaan
  • Lampiran
  • Tipe Koleksi
  • Format Fisik Dokumen
    Lihat Lebih Banyak
  • Lokasi
  • Bahasa
Ditemukan 1 dari pencarian Anda melalui kata kunci: author=Zhang Bei Chao
cover
Improvement of Rough Interface Between Barrier/Seed Layer and Porous Ultralow…
Komentar Bagikan
Ming ZhouHao DengZhang Bei Chao

Abstract With critical dimension of device scaled down to 28 nm technological node and beyond, porous ultralow k (PULK) film as an insulator is used in Cu interconnects to further reduce resistance–capacitance (RC) delay. The integration of the PULK film faces more severe challenges due to the presence of porosity. Plasma treatments and wet cleaning processes have been considered to be cri…

Edisi
VOL. 29, NO. 1, FEBRUARY 2016
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
No. Panggil
-