Uniformity Control of 3-D Stacked ICs: Optical Metrology and Statistical Anal…

Abstract—This paper evaluates various optical metrology techniques for in-line control of the niformity of 3-D stacked structures. Key process steps during 3-D integration flow were identified and characterized in order to quantify their specific intra-wafer dispersion signature. The cross correlation between the various intra-wafer process step signatures was then analyzed to verify the data…