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Ditemukan 1 dari pencarian Anda melalui kata kunci: author=Duane S. Boning
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Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Eliminati…
Komentar Bagikan
Weng Hong TehDuane S. BoningRoy E. Welsch

Abstract—We report on defects characterization and reduction as well as die strength enhancement using stealth dicing (SD) on high-backside reflectance (82%) 2-D NAND memory wafers. This is performed using three-strata subsurface infrared (1.342 μm) nanosecond pulsed laser die singulation with a partial-SD before grinding integration approach. In this paper, a combination of simulation, cha…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
No. Panggil
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