Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing

Abstract “Stealth dicing (SD)” was developed to solve inherent problems of a dicing process such as debris contaminants and unnecessary thermal damages on a work wafer. A completely dry process is another big advantage over other dicing methods. In SD, the laser beam power of transmissible wavelength is absorbed only around focal point in the wafer by utilizing the temperature dependence o…