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Ditemukan 1 dari pencarian Anda melalui kata kunci: author=Min-Suk Jung [et al.]
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Improvement of Electrochemical Migration Resistance by Cu/Sn Intermetallic Co…
Komentar Bagikan
Min-Suk Jung [et al.]

A thin Sn coating was coated on the Cu electrodes on a printed circuit board (PCB) and annealed to form Cu/Sn intermetallic compounds (IMCs). Electrochemical migration (ECM) characteristics were investigated with respect to coating thickness, conductor spacing, and potential bias. From the anodic polarization test, the corrosion current of Cu/Sn IMCs was reduced to nearly two orders of magnitud…

Edisi
VOL. 14, NO. 1, MARCH 2014
ISBN/ISSN
DOI: 10.1109/TDMR.20
Deskripsi Fisik
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 14, NO. 1, MARCH 2014
Judul Seri
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
No. Panggil
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