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Ditemukan 1 dari pencarian Anda melalui kata kunci: author=PAUL E. RILEY [et.al.]
Implementation of Tungsten Metallization In Multilevel Interconnection Techno…
Abstract The techniques of experimental design and response-surface methodology have been used to produce empirical models of the deposition and etchback of tungsten in commercially available reactors for a tungsten plug technology. Deposition was carried out in a Genus 8402 LPCVD batch reactor by the Hz reduction of WF,. Responsesurfaces for deposition rate, sheet resistance uniformity, resi…
- Edisi
- VOL 3. NO 4. NOVEMBER 1990
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE 1RANSACTIONS ON StMICONDUCTOR MANUFACTL!RINCi. VOL 3. NO 1. NOVEMBER I W I
- Judul Seri
- IEEE 1RANSACTIONS ON StMICONDUCTOR MANUFACTL!RINCi. VOL 3. NO 4. NOVEMBER 1990
- No. Panggil
- -
Karya Umum 
Filsafat 
Agama 
Ilmu-ilmu Sosial 
Bahasa 
Ilmu-ilmu Murni 
Ilmu-ilmu Terapan 
Kesenian, Hiburan, dan Olahraga 
Kesusastraan 
Geografi dan Sejarah