Microstructural characterization of Si wafers processed by multi-wire sawing …

The purpose of this work is to verify the possibility to process highly doped Si supporting substrates using a 2-step process:(i) sintering of a low-cost Si powder based ingot using hot pressing and a ELKEM Silgrain material as a feedstock; and (ii) wafering of such ingots using multi-wire sawing technique similar to that, which is used for cast multi-Si or Cz-Si grown ingots. Moreover, the pos…