Study of Chip–Package Interaction Parameters on Interlayer Dielectric Crack…

To meet the electrical performance requirements, copper traces with ultralow-k (ULK) interlayer dielectric (ILD) materials are used in today’s semiconductor devices. The dielectric constant (k) of these materials is often reduced through the introduction of pores or inclusions, and thus, the ULK ILD materials have low fracture strength. During flip-chip assembly, thermally induced stresses oc…