Abstract—We investigated the thermal behavior of defects remaining in low-dose (700 ◦C to remove residual damage as well as to activate impurities.
Index Terms—Residual damage, ion implantation, rapid thermal annealing (RTA), silicon.
Edisi
VOL. 28, NO. 1, FEBRUARY 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 1, FEBRUARY 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 1, FEBRUARY 2015