Thermomechanical Failure Analysis of Through-Silicon Via Interface Using a Sh…

An analytical approach to predict initiation and growth of interfacial delamination in the through-silicon via structure is developed by combining a cohesive zone model with a shear-lag model. Two critical temperatures are predicted for damage initiation and fracture initiation, respectively. It is found that via extrusion significantly increases beyond the second critical temperature. The depe…