Area-Array of 3-Arc-Fan Compliant Interconnects as Effective Drop-Impact Isol…

Abstract—Compliant off-chip interconnects as the first-level and second-level compliant interconnect structures are able to accommodate the differential displacement between the die and the substrate or between the substrate and the board due to their high in-plane and out-of-plane compliance. This paper presents experimental and simulation results of drop testing of silicon substrates with …