Ditapis dengan
Particle Reduction and Control in Plasma Etching Equipment
Abstract—Particles within plasma etching equipment stick to the wafer and cause defects, resulting in large scale integrated circuit (LSI) yield reduction.We observed the behavior of particles resuspended in a vacuum chamber using a laser light scattering method. Investigating the influences of gases, static electricity, and plasma on particle resuspension, we found out that particles are no…
- Edisi
- VOL. 18, NO. 4, NOVEMBER 2005
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 18, NO. 4, NOVEMBER 2005
- Judul Seri
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 18, NO. 4, NOVEMBER 2005
- No. Panggil
- -
Observation and Elimination of Recoil Particles From Turbo Molecular Pumps
Abstract—The existence of recoil particles from the turbo molecular pump has been verified. The recoil particles may be the root cause of yield degradation for the vacuum processes such as the plasma etching processes. To eliminate the recoil particles, they must be trapped inside the turbo molecular pump or inside the manifold chamber. After experimenting with various materials and designs,…
- Edisi
- VOL. 28, NO. 3, AUGUST 2015
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
- Judul Seri
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
- No. Panggil
- -
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