Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT …

The relationship between bonding wire liftoff and terminal voltage in insulated gate bipolar transistor (IGBT) power module is studied. Bonding wire liftoff failure is one of the most dominant limiting factors to the reliability behavior of IGBT power module. In this paper, in order to monitor this type of fault, the effects of the typical degradations are considered. The parasitic inductance a…