Abstract—This paper reports a novel infrared focal plane array (FPA) using SiNx/SiO2/SiNx sandwiched structure as the supporting frames for bimaterial cantilever pixels. The device was fabricated by a bulk silicon process, where a trench backfill technique was employed to form the SiNx/SiO2/SiNx sandwiched frames. By replacing the silicon frame with SiNx/SiO2/SiNx sandwiched frame, the fill f…