Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a S…

The microelectronic packaging field is moving into the third dimension for miniaturization, low power consumption, and better performance. In this paper, we present a double-sided flip-chip (FC) organic substrate with a memory controller on one side of the package and 3-D stacked disaggregated memory chips on the other side of the package. This design allows the controller to interface with th…