Ditapis dengan
Measuring the Manufacturing Yield for Skewed Wire Bonding Processes
Abstract In semiconductor manufacturing, the technologies of stacked semiconductor packaging are important miniaturization strategies in which excellent quality is essential for a good reputation. Yield-based index Cpk has been the most popular tool for successful quality improvement activities and quality program implementation in multichip package processes. For in-plant applications, quali…
- Edisi
- VOL. 28, NO. 3, AUGUST 2015
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
- Judul Seri
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
- No. Panggil
- -
Manufacturing Yield for Multiple Lines Gold Bumping Processes With Asymmetric…
Abstract Development of touch display driver IC (TDDI) has enabled slimmer smartphone design by virtue of the integration of touch controller and display driver ICs (DDIs) into a single chip. TDDI plays an important role in touch integrated display panels. Compared to conventional DDI, TDDI requires more bonding pads for touch applications, thus increasing the usage of gold. The requirement to…
- Edisi
- VOL. 28, NO. 4, NOVEMBER 2015
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
- Judul Seri
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
- No. Panggil
- -
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