Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies…

Abstract—The self-assembly of known good dies on hosting substrates using liquid surface tension is a promising technology to create highly integrated 3-D and heterogeneous microelectronic systems. In this paper, we investigate the effects of the edge structures of self-assembled chips on alignment accuracies. Nine types of 100-μm-thick Si chips (3 mm × 3 mm) with and without step geometrie…