Abstract With the development of integrated circuit (IC) chips, the semiconductor industry has begun using many ultrathin chips. To prevent cracking when they are picked up by the machinery, the precise pose of every chip must be provided using the image matching approach. Traditional feature point matching methods are robust to the pose changes of a single chip, but they are not effective for…
Abstract With the development of integrated circuit (IC) chips, many elongated chips with small amounts of textures have begun to be used in IC packaging and manufacturing. Traditional template-matching methods are not effective for positioning these chips; this limitation results in IC equipment that cannot accurately pick up an elongated IC chip or may package a nonworking IC chip onto an el…