e-journal

Characterization and Reliability of Sintered Nanosilver Joints by a Rapid Current-Assisted Method for Power Electronics Packaging

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A rapid current-assisted sintering technology (CAST) was used to bond electronic devices with nanosilver
paste, which is a promising alternative compared with traditional solders. Instead of using an external heating source, the specimen and bonding material of nanosilver paste were heated by the alternating current whose current direction is not constant. Die-shear testing and hardness measurement were used to
evaluate the bonding strength. The bonding strength and hardness increase with increasing the current and/or current-on time. CAST was able to sinter nanosilver in a very short time, i.e., less than 1 s. Scanning electron microscopy was used to characterize the microstructures of sintered silver joints. The
reliability of the sintered joints by CAST was also evaluated by cyclic shearing tests. The joint by CAST could survive much longer time than that by the conventional hot pressing way. The CAST was recommended to bond two pieces of bare copper with nanosilver paste in power electronic applications without any
protective gas atmosphere, e.g., bus bar connection.
Index Terms—Copper, cycling, hardness, microstructures, shear strength, silver nanoparticles.

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Ketersediaan

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Informasi Detail

Judul Seri

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

No. Panggil

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Penerbit

New York : IEEE., 2014

Deskripsi Fisik

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 14, NO. 1, MARCH 2014

Bahasa

English

ISBN/ISSN

1530-4388

Klasifikasi

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Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

VOL. 14, NO. 1, MARCH 2014

Subjek

TEKNIK

Info Detail Spesifik

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Pernyataan Tanggungjawab

Yuli/Agus

Versi lain/terkait

Lampiran Berkas

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