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Phase Transformation of Monocrystalline Silicon Induced by Polishing With Diamond Abrasives

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Abstract—A newly developed semi-fixed flexible polishing tool called sol-gel (SG) polishing pads can satisfy the polishing demand of silicon wafers with scratch-free and nanoroughness surface. However, an obvious damage layer emerges on the surface of monocrystalline silicon wafer after polished by SG polishing pads with diamond abrasives. In this paper, combined characterizations consist of grazing incidence X-ray diffraction, Raman spectroscopy (RS), focused ion beamscanning electron microscopy (FIB-SEM), transmission electron microscopy (TEM), and SEM were used to observe the damage layer together with the polishing residue. The results indicated that the surface monocrystalline silicon transformed to α-Si and nano-Si. Analysis on the polishing processes under the same experimental parameters with different tools and abrasives revealed that the material removing scale about 100–300 nm may account for the generation of damage layer.

Index Terms—Sol-gel (SG) polishing pads, silicon wafer, diamond abrasives, damage layer.

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Informasi Detail

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 2, MAY 2015

No. Panggil

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Penerbit

: IEEE., 2015

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 2, MAY 2015

Bahasa

English

ISBN/ISSN

0894-6507

Klasifikasi

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Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

VOL. 28, NO. 2, MAY 2015

Subjek

SEMIKONDUKTOR

Info Detail Spesifik

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Pernyataan Tanggungjawab

ETY

Versi lain/terkait

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