Abstract—A variety of statistical and data-mining techniques have been developed for the fault detection (FD) modeling of semiconductor manufacturing processes over the past three decades. However, few studies have analyzed which models are adequate for different types of fault data. In this paper, we define a FD model as an algorithm combining feature extraction, feature selection, and class…
Abstract A yield analysis method using basic yield and in-line defect information in a statistical model to determine root-causes of yield loss in semiconductor manufacturing is presented. The goal of this analysis method is to provide the fab process line management yield loss accounting for defects identified at inspected process layers. Quantifying these losses, in terms of yield loss perce…
Abstract Training fault detection model requires advanced data-mining algorithms when the growth rate of the process data is notably high and normal-class data overwhelm fault-class data in number. Most standard classification algorithms, such as support vector machines (SVMs), can handle moderate sizes of training data and assume balanced class distributions. When the class sizes are highly …
Abstract Root cause detecting and rapid yield ramping for advanced technology nodes are crucial to maintain competitive advantages for semiconductor manufacturing. Since the data structure is increasingly complicated in a fully automated wafer fabrication facility, it is difficult to diagnose the whole production system for fault detection. A number of approaches have been proposed for fault d…