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Ditemukan 3 dari pencarian Anda melalui kata kunci: author=Jun-Ho Lee
cover
Scheduling Cluster Tools for Concurrent Processing of Two Wafer Types
Komentar Bagikan
Jun-Ho LeeHyun-Jung KimTae-Eog Lee

We examine a scheduling problemof cluster tools that concurrently process two wafer types in a cyclic operational sequence. Whereas the process steps for different wafer types are assigned to different processing modules (PMs), the wafer loading and unloading tasks at the PMs are performed by a single robot. For a given cycle plan, which is a mix of different wafers for each cycle, we wish to d…

Edisi
VOL. 11, NO. 2, APRIL 2014
ISBN/ISSN
1545-5955
Deskripsi Fisik
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, VOL. 11, NO. 2, APRIL 2014
Judul Seri
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING
No. Panggil
-
Ketersediaan0
Tambahkan ke dalam keranjang
Unduh MARCSitasi
cover
Noncyclic Scheduling of Cluster Tools With a Branch and Bound Algorithm
Komentar Bagikan
Jun-Ho LeeHyun-Jung KimTae-Eog Lee

Abstract—Cluster tools, each of which consists of multiple processing modules, one material handling robot, and loadlocks, are widely used for wafer fabrication processes, such as lithography, etching, and deposition. There have been many approaches and algorithms for cyclic scheduling of cluster tools in which the robot repeats a specified sequence for processing identical wafers. However, t…

Edisi
1545-5955
ISBN/ISSN
1545-5955
Deskripsi Fisik
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, VOL. 12, NO. 2, APRIL 2015
Judul Seri
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING
No. Panggil
-
Ketersediaan0
Tambahkan ke dalam keranjang
Unduh MARCSitasi
cover
Makespan Analysis of Lot Switching Period in Cluster Tools
Komentar Bagikan
Jun-Ho LeeHyun-Jung Kim

Abstract Cluster tools each of which consists of processing modules (PMs), a transport robot and loadlocks perform most wafer fabrication processes in semiconductor manufacturing. Recently, the lot size has been decreasing from 25 wafers to even 7-8 wafers due to the larger wafer size and circuit width reduction especially in large scale integration (LSI) manufacturing. Hence, the lot switchin…

Edisi
-
ISBN/ISSN
0894-6507
Deskripsi Fisik
-
Judul Seri
-
No. Panggil
-
Ketersediaan0
Tambahkan ke dalam keranjang
Unduh MARCSitasi
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