Ditapis dengan
Through-Silicon-Via Fabrication Technologies, Passives Extraction, and Electr…
Abstract—Major advances have been made in the processing technologies of through-silicon-vias (TSVs) because TSV is an essential element for both wafer-level 3-D integration and packaging-based 3-D integration, due to its short interconnect length, high interconnect density, and small footprint. Based on a review of current TSV technologies, this paper reports a number of recently developed e…
- Edisi
- VOL. 26, NO. 1, FEBRUARY 2013
- ISBN/ISSN
- 0894-6507
- Deskripsi Fisik
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 26, NO. 1, FEBRUARY 2013
- Judul Seri
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 26, NO. 1, FEBRUARY 2013
- No. Panggil
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Remarkable hexagonal carbon tubes transformed from zinc tetrapyridylporphine
Abstract. Herein, a simple template-free method to the preparation of hexagonal carbon microtubes by pyrolysis of zinc tetrapyridylporphine (ZnTPyP) was reported. With cetyltrimethyl ammonium bromide as the auxiliary agent, ZnTPyP molecules assemble into hexagonal microtubes. Corresponding ZnTPyP microtubes and microrods can be selectively fabricated by changing the concentration of tetrap…
- Edisi
- -
- ISBN/ISSN
- -
- Deskripsi Fisik
- CA R B O N 4 7 ( 2 0 0 9 ) 5 2 7 –5 4 4
- Judul Seri
- CA R B O N
- No. Panggil
- -
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