A Compact Fourier Transform Spectrometer on a Silicon Optical Bench With an E…

Abstract—This paper reports a compact Fourier transform spectrometer system with a large-stroke electrothermal microelectromechanical systems (MEMS) mirror and other optical components all integrated on a micromachined silicon optical bench with the footprint of 2 cm × 2 cm. The linear optical path difference (OPD) scan range generated by the MEMS mirror reaches up to 450 μm, and the tiltin…

3-D Non-UV Digital Printing of Hydrogel Microstructures by Optically Controll…

Abstract—A technique using digital masks without ultraviolet light to rapidly print 3-D biopolymer structures with complex microarchitectures in a microfluidic chip has been demonstrated. In this approach, a customized system is used to project light images on a photoconductive substrate in order to create localized virtual electrodes when an alternating electric field is applied across the f…

2-D Electrostatic Actuation of Microshutter Arrays

Abstract—Electrostatically actuated microshutter arrays consisting of rotational microshutters (shutters that rotate about a torsion bar) were designed and fabricated through the use of models and experiments. Design iterations focused on minimizing the torsional stiffness of the microshutters while maintaining their structural integrity. Mechanical and electromechanical test systems were con…

Yield Prediction Through the Event Sequence Analysis of the Die Attach Process

Abstract—Die attach is the process of mounting a plurality of dice to a printed circuit board (PCB) or substrate. Die attach is critical to the thermal and electrical performance of semiconductor products, significantly affecting the final yield of PCBs. In general, the die attacher records alarm events, change events, and maintenance events in a log. Alarm events occur when dice are not alig…

Wafer Surface Charging Model for Single-Wafer Wet-Spin Processes

Abstract—Wet chemical processes in integrated circuit (IC) manufacturing are used in many applications, e.g., post-etch residue removal and pre-deposition surface treatment. While advanced single-wafer wet spin tools are part of the critical toolset for advanced IC fabrication, non-optimized tool hardware and/or process may induce different types of wafer surface charging issues. In this pap…

Using Wafer Map Features to Better Predict Die-Level Failures in Final Test

Abstract—In semiconductor manufacturing, wafer fabrication is followed by chip assembly where individual dies are assembled as a packaged chip. In between, dies are tested in terms of their electrical properties and those which fail to pass the “wafer test” are filtered out. However, some faulty dies pass the test and cause a packaged chip to fail in the final test. The inaccuracy of the …

Uniformity Control of 3-D Stacked ICs: Optical Metrology and Statistical Anal…

Abstract—This paper evaluates various optical metrology techniques for in-line control of the niformity of 3-D stacked structures. Key process steps during 3-D integration flow were identified and characterized in order to quantify their specific intra-wafer dispersion signature. The cross correlation between the various intra-wafer process step signatures was then analyzed to verify the data…

Tutorial on Applying the VM Technology for TFT-LCD Manufacturing

Abstract—In the high-tech industries, on-line quality monitoring on each workpiece under processing is required to ensure process stability and improve yield rate. However, conducting workpiece-by-workpiece actual metrology is very expensive and time-consuming. In this case, a novel idea is to use “virtual metrology” (VM) that conjectures workpiece quality based on process data collected…

Tristate Inverter Array: A New Technology Development Yield Learning Vehicle …

Edisi

VOL. 28, NO. 4, NOVEMBER 2015

ISBN/ISSN

0894-6507

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015

No. Panggil

-

Thermal Stress Effects on the Electrical Properties of p-Channel Polycrystall…

Abstract—We developed a method to compact the glass sheets of a flat-panel displays that use metal-induced laterally crystallized (MILC) polycrystalline-silicon (poly-Si) thin-film transistors (TFTs), and the effects of thermal stress on the fabricated devices were compared against those of a bare-glass device. The glass substrate was exposed to a temperature of 650 ◦C for 40 h in order to …

Temperature-Dependent Emissivity of Silicon-Related Materials and Structures

Abstract— The results of an ongoing collaborative project between the New Jersey Institute of Technology (NJIT) and SEMATECH on the temperature-dependent emissivity of siliconrelated materials and structures are presented in this study. These results have been acquired using a spectral emissometer. This emissometer consists of a Fourier Transform Infra-Red (FTIR) spectrometer designed specifi…

Step-Down Spatial Randomness Test for Detecting Abnormalities in DRAM Wafers …

Abstract—Defects on semiconductor wafers are not uniformly distributed, but tend to cluster. These spatial defect patterns contain useful information about issues during integrated circuit fabrication. Promptly detecting abnormal wafers is an important way to increase yield and product quality. However, research on identifying spatial defect patterns has focused only on flash memory with a s…

Stability and Control Performance Analysis of Double EWMA Controller With Met…

Abstract—This paper mainly focuses on establishing the stability conditions of the double exponentially weighted moving average (d-EWMA) controller with metrology delay when the process experiences a general disturbance and analyzing its control performance under some typical types of process disturbance. The necessary and sufficient conditions for stability are established by Routh–Hurwit…

Scheduling of Single-Arm Multi-cluster Tools With Wafer Residency Time Constr…

Abstract—This paper studies the challenging problem of scheduling single-arm multi-cluster tools with wafer residency time constraints. They have a linear topology and their bottleneck tool is process-bound. This work aims to find an optimal one-wafer cyclic schedule. With the Petri net model developed in our previous work and the minimal cycle time for a multicluster tool without wafer resi…

Scheduling In-Line Multiple Cluster Tools

Abstract—A cluster tool which is widely used for wafer fabrication processes consists of several processing modules (PMs), a transport robot, loadlocks, and an equipment front-end module (EFEM) in which a wafer cassette is loaded and unloaded. A wafer cassette with 25 identical wafers is transported by an overhead hoist transfer (OHT) between cluster tools and stored in a stocker when the co…

Scheduling and Analysis of Start-Up Transient Processes for Dual-Arm Cluster …

Abstract—The trends of increasing wafer diameter and smaller lot sizes have led to more transient periods in wafer fabrication. For some wafer fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a so-called revisiting process. Most previous studies on cluster tool scheduling focus on steady s…

Guidance for Schools Selecting Antibullying Approaches: Translating Evidence-…

This article synthesizes the current research on bullying prevention and intervention in order to provide guidance to schools seeking to select and implement antibullying strategies. Evidence-based best practices that are shared across generally effective antibullying approaches are elucidated, and these strategies are grounded in examples garnered from model antibullying programs as implemente…

The extinction of the dinosaurs

Non-avian dinosaurs went extinct 66 million years ago, geologically coincident with the impact of a large bolide (comet or asteroid) during an interval of massive volcanic eruptions and changes in temperature and sea level. There has long been fervent debate about how these events affected dinosaurs. We review a wealth of new data accumulated over the past two decades, provide updated and novel…

Good Ol’ Boys, Mean Girls, and Tyrants

Bullying in higher education is an increasingly common phenomenon that negatively affects organizational climate, completed work’s quality and quantity, and students’ educational experiences. The purpose of this phenomenological study was to investigate the lived experiences of women adult educators who were targets of bullying. Six themes emerged from the composite participant experiences …

Randomized General Regression Network for Identification of Defect Patterns i…

Abstract—Defect detection and classification in semiconductor wafers has received an increasing attention from both industry and academia alike. Wafer defects are a serious problem that could cause massive losses to the companies’ yield. The defects occur as a result of a lengthy and complex fabrication process involving hundreds of stages, and they can create unique patterns. If these patt…

Process Development and Optimization for 3 μm High Aspect Ratio Via-Middle T…

Abstract—This paper presents challenges encountered in the fabrication of high aspect ratio (AR) via middle, through-silicon vias (TSVs), of 3 μm top entrant critical dimension and 50 μm depth. Higher AR TSV integration is explored due to the lower stress and copper pumping influence of TSVs observed in adjacent CMOS devices. The key process improvements demonstrated in this paper include 3…

Particle Transport in Etching Chamber Influenced by Coulomb Force

Edisi

VOL. 28, NO. 3, AUGUST 2015

ISBN/ISSN

0894-6507

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015

No. Panggil

-

Particle Reduction and Control in Plasma Etching Equipment

Abstract—Particles within plasma etching equipment stick to the wafer and cause defects, resulting in large scale integrated circuit (LSI) yield reduction.We observed the behavior of particles resuspended in a vacuum chamber using a laser light scattering method. Investigating the influences of gases, static electricity, and plasma on particle resuspension, we found out that particles are no…

Optimization of Re-Entrant Hybrid Flows With Multiple Queue Time Constraints …

Abstract—This paper proposes optimization methods of re-entrant hybrid flows with multiple queue time constraints in batch processes of semiconductor manufacturing. A smoothing flow concept and a dispatching rule for the re-entrant flows called “re-entrant flow smoothing” [REFS(X)] and a loading rule for the processes with multiple queue time constraints called “synchronized control of…

Novel Approaches to Optimizing Carrier Logistics in Semiconductor Manufacturing

Abstract—This paper provides an overview of new approaches for assessing and addressing requirements for carrier logistics in semiconductor manufacturing and discusses solutions for optimizing the efficiency of capital equipment installed in the fab. An exploration of crucial influencing factors (both on the material handling as well as on the equipment side) will be followed by a discussion …

Non-Contact, Sub-Surface Detection of Alloy Segregation in Back-End of Line C…

Abstract—Alloy seedlayers for copper back-end of line interconnects have become common at technology groundrules of 45 nm and below, due to reliability requirements. The key requirement of the minority alloy component (e.g., Al or manganese, also referred to as the “dopant”) is that it segregates to the copper (Cu)/dielectric cap layer interface in order to promote adhesion between the C…

Modeling and Optimal Design of a Glass RTP System

Abstract—The problem of modeling and generating an optimal design of a rapid thermal processing (RTP) system for flat panel display glass was addressed. An RTP system using bulb-type tungsten-halogen lamps was considered, and a dynamic model to describe the glass temperature distribution was established. The power dispersion function comprising the model was established in an experimental R…

Measuring the Manufacturing Yield for Skewed Wire Bonding Processes

Abstract In semiconductor manufacturing, the technologies of stacked semiconductor packaging are important miniaturization strategies in which excellent quality is essential for a good reputation. Yield-based index Cpk has been the most popular tool for successful quality improvement activities and quality program implementation in multichip package processes. For in-plant applications, quali…

Measurement and Analysis of Seismic Response in Semiconductor Manufacturing E…

Abstract In this paper, a cost-effective, easy-install and fast measurement and analysis method to obtain seismic response of semiconductor manufacturing equipments was developed and its validity was discussed. In the developed method, micro-vibration measurement experiments are first carried out to obtain transfer functions and coherence functions from the floor to arbitrary part of equipment…

Manufacturing Yield for Multiple Lines Gold Bumping Processes With Asymmetric…

Abstract Development of touch display driver IC (TDDI) has enabled slimmer smartphone design by virtue of the integration of touch controller and display driver ICs (DDIs) into a single chip. TDDI plays an important role in touch integrated display panels. Compared to conventional DDI, TDDI requires more bonding pads for touch applications, thus increasing the usage of gold. The requirement to…

Manufacturing Challenges of GaN-on-Si HEMTs in a 200mm CMOS Fab

Abstract In this paper, we report on the challenges related to growth and processing of 200mm GaN-on-Si wafers in a CMOS fab. We describe the Au free process we developed as well as how we assure wafer quality prior processing. For the first time, we analyze possible Ga contamination issues related to the processing of GaN wafers and we present the cleaning procedures we developed to avoid it…

In Search of “Forever,” Continued Transistor Scaling One New Material at …

Abstract This work looks at past, present, and future material changes for the metal–oxide–semiconductor field-effect transistor (MOSFET). It is shown that conventional planar bulk MOSFET channel length scaling, which has driven the industry for the last 40 years, is slowing. To continue Moore’s law, new materials and structures are required. The first major material change to extend Moo…

Implementation of Tungsten Metallization In Multilevel Interconnection Techno…

Abstract The techniques of experimental design and response-surface methodology have been used to produce empirical models of the deposition and etchback of tungsten in commercially available reactors for a tungsten plug technology. Deposition was carried out in a Genus 8402 LPCVD batch reactor by the Hz reduction of WF,. Responsesurfaces for deposition rate, sheet resistance uniformity, resi…

Impacts of Differences in Epidemiological Case Definitions on Prevalence for …

evaluate prevalence based on variations in case definitions used for epidemiological studies of musculoskeletal disorders (MSDs). Background: Prior studies of MSDs have mostly relied on a single case definition based on questionnaires. Method: In a multicenter prospective cohort study, we systematically collected data to evaluate impacts of differences in case definitions of MSDs on prevalenc…

Health Index Extraction Methods for Batch Processes in Semiconductor Manufact…

Abstract This paper deals with a study of three methods for health index (HI) extraction in semiconductor manufacturing equipments. The first method uses degradation reconstruction-based identification with basic principal component analysis (PCA), the second one uses multiway PCA and the last one extracts HI from the significant points related to degradation. A comparison of these methods are…

Full-Wafer Voltage Contrast Inspection for Detection of BEOL Defects

Abstract This paper details an application where E-beam inspection (EBI) can be used for 100% full wafer inspection, generally considered a mythical target for EBI. For process layers where the line-widths and defects of interest are large, very large pixel size and high scan frequency can be used, thereby making full wafer inspection feasible. The metal layers in the back-endof-line fit this …

Fluorocarbon Chemistry: A 0-Dimensional Model for Oxide and Nitride Dry Etching

Abstract In this paper, a 0-dimensional model for the understanding of dry etching characteristics in silicon oxide and nitride materials is reported. The model is applied to analyze the etching performances in a design of experiments where gas mixtures are varied in the fluorocarbon chemistry typical of the “protected sidewall” regime. The modeling analysis of flat sample etching allows f…

The Association Between Combination of Hand Force and Forearm Posture and Inc…

Objective: The objective of this prospective study is to investigate the exposure–response relationships between various workplace physical exposures of force, repetition, and their combination assessed at an individual level with lateral epicondylitis (LE). Background: Workplace upper extremity musculoskeletal disorders (UEMSDs) are prevalent, disabling, and expensive. LE is one of the majo…

Flexible Pressure Sensors Based on Screen-Printed P(VDF-TrFE) and P(VDF-TrFE)…

Abstract This paper presents large-area-printed flexible pressure sensors developed with an all screen-printing technique. The 4 × 4 sensing arrays are obtained by printing polyvinylidene fluoride-trifluoroethylene P(VDF-TrFE) and their nanocomposite with multi-walled carbon nanotubes (MWCNTs) and are sandwiched between printed metal electrodes in a parallel plate structure. The bottom electr…

Efficacy of the Revised NIOSH Lifting Equation to Predict Risk of Low-Back Pa…

Objective: The objective was to evaluate the efficacy of the Revised National Institute for Occupational Safety and Health (NIOSH) lifting equation (RNLE) to predict risk of low-back pain (LBP). Background: In 1993, NIOSH published the RNLE as a risk assessment method for LBP associated with manual lifting. To date, there has been little research evaluating the RNLE as a predictor of the risk…

The NIOSH Lifting Equation and Low-Back Pain, Part 2: Association With Seeki…

Objective: The aim of this study was to investigate the relationship between the revised NIOSH lifting equation (RNLE) and risk of seeking care for low-back pain (SC-LBP). Background: The RNLE is commonly used to quantify low-back physical stressors from lifting/lowering of loads in workplaces. There is no prospective study on relationship between RNLE and SC-LBP. Method: A cohort of 258 inci…

The State of Knowledge of Outdoor Orientation Programs: Current Practices, Re…

Outdoor orientation programs represent a prominent area of experiential education with over 25,000 participants annually. More than 191 outdoor orientation programs currently operate in the United States and Canada. The research examining outdoor orientation programs consists of 25 peer-reviewed published studies and 11 dissertations. A new theory explaining the success of these programs has em…

Comparing the surgical timelines of military and civilians traumatic lower li…

The care and challenges of injured service have been well documented in the literature from a variety of specialities. The aim of this study was to analyse the surgical timelines of military and civilian traumatic amputees and compare the surgical and resuscitative interventions. A retrospective review of patient notes was undertaken. Military patients were identified from the Joint Theatr…

The NIOSH Lifting Equation and Low-Back Pain, Part 1: Association With Low-Ba…

Objective: The aim of this study was to evaluate relationships between the revised NIOSH lifting equation (RNLE) and risk of low-back pain (LBP). Background: The RNLE is commonly used to quantify job physical stressors to the low back from lifting and/or lowering of loads. There is no prospective study on the relationship between RNLE and LBP that includes accounting for relevant covariates.…

Fast Scheduling of Semiconductor Manufacturing Facilities Using Case-Based Re…

Edisi

VOL. 29, NO. 1, FEBRUARY 2016

ISBN/ISSN

0894-6507

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016

No. Panggil

-

Fabrication, Characterization, and Simulation of a Low-cost TSV Integration w…

Abstract In this study, a low-cost through-multilayer TSV integration process has been developed. The features are that a double-layer spin coating technique is applied to prevent residual photoresist left inside TSVs. Besides, redistribution layer is deposited before TSV filling in order to eliminate the front-side CMP process, which will lower the fabrication cost. Basic electrical tests of…

Autonomous Student Experiences in Outdoor and Adventure Education

This article explores the current state of knowledge regarding the use of autonomous student experiences (ASE) in outdoor and adventure education (OAE) programs. ASE are defined as components (e.g., solo, final expedition) in which participants have a greater measure of choice and control over the planning, execution, and outcomes of their learning. The article discusses the importance of ASE i…

Enhancement of the Virtual Metrology Performance for Plasma-Assisted Oxide Et…

Abstract Virtual metrology (VM) model based on plasma information (PI) parameter for C4F8 plasma-assisted oxide etching processes is developed to predict and monitor the process results such as an etching rate with improved performance. To apply fault detection and classification or advanced process control models on to the real-mass production lines efficiently, high-performance VM model is …

Effect of Plasma Process for SiO2 Film on Sidewall

Abstract We evaluated the physical and electrical characteristics of SiO2 treated by plasma oxidation on top and sidewall. The plasma process is less effective for SiO2 on sidewall than on top and further less for small pattern. Both the characteristics for SiO2 on sidewall are sensitive to plasma condition in deposition sequence, while not for SiO2 on top. When the plasma process is used as …

GB virus C infection in Indonesian HIV‐positive patients

GB virus C (GBV‐C), a human virus of the Flaviviridae family that is structurally and epidemiologically closest to hepatitis C virus (HCV), has been reported to confer beneficial outcomes in HIV‐positive patients.However, the prevalence of GBV‐C in HIV‐positive individuals in Indonesia is unknown. Since GBV‐C is more prevalent in anti‐HCV positive patients than in anti‐HCV negativ…