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Ditemukan 2488 dari pencarian Anda melalui kata kunci: author="T. Waldhor"
Hal. Awal Sebelumnya 46 47 48 49 50 Hal. Akhir
cover
Manufacturing Challenges of GaN-on-Si HEMTs in a 200mm CMOS Fab
Komentar Bagikan
D. Marcon [et.al.]

Abstract In this paper, we report on the challenges related to growth and processing of 200mm GaN-on-Si wafers in a CMOS fab. We describe the Au free process we developed as well as how we assure wafer quality prior processing. For the first time, we analyze possible Ga contamination issues related to the processing of GaN wafers and we present the cleaning procedures we developed to avoid it…

Edisi
VOL. 26, NO. 3, AUGUST 2013
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 26, NO. 3, AUGUST 2013
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 26, NO. 3, AUGUST 2013
No. Panggil
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Unduh MARCSitasi
cover
In Search of “Forever,” Continued Transistor Scaling One New Material at …
Komentar Bagikan
Scott E. Thompson [et.al.]

Abstract This work looks at past, present, and future material changes for the metal–oxide–semiconductor field-effect transistor (MOSFET). It is shown that conventional planar bulk MOSFET channel length scaling, which has driven the industry for the last 40 years, is slowing. To continue Moore’s law, new materials and structures are required. The first major material change to extend Moo…

Edisi
VOL. 18, NO. 1, FEBRUARY 2005
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 18, NO. 1, FEBRUARY 2005
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 18, NO. 1, FEBRUARY 2005
No. Panggil
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cover
Implementation of Tungsten Metallization In Multilevel Interconnection Techno…
Komentar Bagikan
PAUL E. RILEY [et.al.]

Abstract The techniques of experimental design and response-surface methodology have been used to produce empirical models of the deposition and etchback of tungsten in commercially available reactors for a tungsten plug technology. Deposition was carried out in a Genus 8402 LPCVD batch reactor by the Hz reduction of WF,. Responsesurfaces for deposition rate, sheet resistance uniformity, resi…

Edisi
VOL 3. NO 4. NOVEMBER 1990
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE 1RANSACTIONS ON StMICONDUCTOR MANUFACTL!RINCi. VOL 3. NO 1. NOVEMBER I W I
Judul Seri
IEEE 1RANSACTIONS ON StMICONDUCTOR MANUFACTL!RINCi. VOL 3. NO 4. NOVEMBER 1990
No. Panggil
-
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Impacts of Differences in Epidemiological Case Definitions on Prevalence for …
Komentar Bagikan
Kurt T. Hegmann [et.al.]

evaluate prevalence based on variations in case definitions used for epidemiological studies of musculoskeletal disorders (MSDs). Background: Prior studies of MSDs have mostly relied on a single case definition based on questionnaires. Method: In a multicenter prospective cohort study, we systematically collected data to evaluate impacts of differences in case definitions of MSDs on prevalenc…

Edisi
Vol. 56, No. 1, February 2014, pp. 191– 202
ISBN/ISSN
DOI: 10.1177/0018720
Deskripsi Fisik
Epidemiological Studies of Workplace Musculoskeletal Disorders 2014
Judul Seri
Epidemiological Studies of Workplace Musculoskeletal Disorders
No. Panggil
-
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Unduh MARCSitasi
cover
Health Index Extraction Methods for Batch Processes in Semiconductor Manufact…
Komentar Bagikan
Thi-Bich-Lien Nguyen [et.al.]

Abstract This paper deals with a study of three methods for health index (HI) extraction in semiconductor manufacturing equipments. The first method uses degradation reconstruction-based identification with basic principal component analysis (PCA), the second one uses multiway PCA and the last one extracts HI from the significant points related to degradation. A comparison of these methods are…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
No. Panggil
-
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cover
Full-Wafer Voltage Contrast Inspection for Detection of BEOL Defects
Komentar Bagikan
Richard F. Hafer [et.al.]

Abstract This paper details an application where E-beam inspection (EBI) can be used for 100% full wafer inspection, generally considered a mythical target for EBI. For process layers where the line-widths and defects of interest are large, very large pixel size and high scan frequency can be used, thereby making full wafer inspection feasible. The metal layers in the back-endof-line fit this …

Edisi
VOL. 28, NO. 4, NOVEMBER 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
No. Panggil
-
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cover
Fluorocarbon Chemistry: A 0-Dimensional Model for Oxide and Nitride Dry Etching
Komentar Bagikan
Giuseppe Garozzo [et.al.]

Abstract In this paper, a 0-dimensional model for the understanding of dry etching characteristics in silicon oxide and nitride materials is reported. The model is applied to analyze the etching performances in a design of experiments where gas mixtures are varied in the fluorocarbon chemistry typical of the “protected sidewall” regime. The modeling analysis of flat sample etching allows f…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
No. Panggil
-
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cover
The Association Between Combination of Hand Force and Forearm Posture and Inc…
Komentar Bagikan
Z. Joyce Fan [et.al.]

Objective: The objective of this prospective study is to investigate the exposure–response relationships between various workplace physical exposures of force, repetition, and their combination assessed at an individual level with lateral epicondylitis (LE). Background: Workplace upper extremity musculoskeletal disorders (UEMSDs) are prevalent, disabling, and expensive. LE is one of the majo…

Edisi
Vol. 56, No. 1, February 2014, pp. 151– 165
ISBN/ISSN
DOI: 10.1177/0018720
Deskripsi Fisik
Epidemiological Studies of Workplace Musculoskeletal Disorders 2014
Judul Seri
Epidemiological Studies of Workplace Musculoskeletal Disorders
No. Panggil
-
Ketersediaan0
Tambahkan ke dalam keranjang
Unduh MARCSitasi
cover
Flexible Pressure Sensors Based on Screen-Printed P(VDF-TrFE) and P(VDF-TrFE)…
Komentar Bagikan
Saleem Khan [et.al.]

Abstract This paper presents large-area-printed flexible pressure sensors developed with an all screen-printing technique. The 4 × 4 sensing arrays are obtained by printing polyvinylidene fluoride-trifluoroethylene P(VDF-TrFE) and their nanocomposite with multi-walled carbon nanotubes (MWCNTs) and are sandwiched between printed metal electrodes in a parallel plate structure. The bottom electr…

Edisi
VOL. 28, NO. 4, NOVEMBER 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
No. Panggil
-
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Unduh MARCSitasi
cover
Efficacy of the Revised NIOSH Lifting Equation to Predict Risk of Low-Back Pa…
Komentar Bagikan
Ming-Lun Lu [et.al.]

Objective: The objective was to evaluate the efficacy of the Revised National Institute for Occupational Safety and Health (NIOSH) lifting equation (RNLE) to predict risk of low-back pain (LBP). Background: In 1993, NIOSH published the RNLE as a risk assessment method for LBP associated with manual lifting. To date, there has been little research evaluating the RNLE as a predictor of the risk…

Edisi
Vol. 56, No. 1, February 2014, pp. 73– 85
ISBN/ISSN
DOI: 10.1177/0018720
Deskripsi Fisik
Epidemiological Studies of Workplace Musculoskeletal Disorders 2014
Judul Seri
Epidemiological Studies of Workplace Musculoskeletal Disorders
No. Panggil
-
Ketersediaan0
Tambahkan ke dalam keranjang
Unduh MARCSitasi
cover
The NIOSH Lifting Equation and Low-Back Pain, Part 2: Association With Seeki…
Komentar Bagikan
Arun Garg [et.al.]

Objective: The aim of this study was to investigate the relationship between the revised NIOSH lifting equation (RNLE) and risk of seeking care for low-back pain (SC-LBP). Background: The RNLE is commonly used to quantify low-back physical stressors from lifting/lowering of loads in workplaces. There is no prospective study on relationship between RNLE and SC-LBP. Method: A cohort of 258 inci…

Edisi
Vol. 56, No. 1, February 2014, pp. 44– 57
ISBN/ISSN
DOI: 10.1177/0018720
Deskripsi Fisik
Epidemiological Studies of Workplace Musculoskeletal Disorders 2014
Judul Seri
Epidemiological Studies of Workplace Musculoskeletal Disorders
No. Panggil
-
Ketersediaan0
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Unduh MARCSitasi
cover
The State of Knowledge of Outdoor Orientation Programs: Current Practices, Re…
Komentar Bagikan
Brent J. Bell [et.al.]

Outdoor orientation programs represent a prominent area of experiential education with over 25,000 participants annually. More than 191 outdoor orientation programs currently operate in the United States and Canada. The research examining outdoor orientation programs consists of 25 peer-reviewed published studies and 11 dissertations. A new theory explaining the success of these programs has em…

Edisi
Vol. 37(1) 31– 45
ISBN/ISSN
DOI: 10.1177/1053825
Deskripsi Fisik
Journal of Experiential Education 2014
Judul Seri
Journal of Experiential Education
No. Panggil
-
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Unduh MARCSitasi
cover
Comparing the surgical timelines of military and civilians traumatic lower li…
Komentar Bagikan
R.M.T. Staruch [et al.]

The care and challenges of injured service have been well documented in the literature from a variety of specialities. The aim of this study was to analyse the surgical timelines of military and civilian traumatic amputees and compare the surgical and resuscitative interventions. A retrospective review of patient notes was undertaken. Military patients were identified from the Joint Theatr…

Edisi
6 (2016)
ISBN/ISSN
http://dx.doi.org/10
Deskripsi Fisik
Annals of Medicine and Surgery 6 (2016) 81-86
Judul Seri
Annals of Medicine and Surgery
No. Panggil
-
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Unduh MARCSitasi
cover
The NIOSH Lifting Equation and Low-Back Pain, Part 1: Association With Low-Ba…
Komentar Bagikan
Arun Garg [et.al.]

Objective: The aim of this study was to evaluate relationships between the revised NIOSH lifting equation (RNLE) and risk of low-back pain (LBP). Background: The RNLE is commonly used to quantify job physical stressors to the low back from lifting and/or lowering of loads. There is no prospective study on the relationship between RNLE and LBP that includes accounting for relevant covariates.…

Edisi
Vol. 56, No. 1, February 2014, pp. 6– 28
ISBN/ISSN
DOI: 10.1177/0018720
Deskripsi Fisik
Epidemiological Studies of Workplace Musculoskeletal Disorders 2014
Judul Seri
Epidemiological Studies of Workplace Musculoskeletal Disorders
No. Panggil
-
Ketersediaan0
Tambahkan ke dalam keranjang
Unduh MARCSitasi
cover
Fast Scheduling of Semiconductor Manufacturing Facilities Using Case-Based Re…
Komentar Bagikan
Junseok Lim [et.al.]

Edisi
VOL. 29, NO. 1, FEBRUARY 2016
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
No. Panggil
-

Edisi
VOL. 29, NO. 1, FEBRUARY 2016
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
No. Panggil
-
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cover
Fabrication, Characterization, and Simulation of a Low-cost TSV Integration w…
Komentar Bagikan
Yong Guan [et.al.]

Abstract In this study, a low-cost through-multilayer TSV integration process has been developed. The features are that a double-layer spin coating technique is applied to prevent residual photoresist left inside TSVs. Besides, redistribution layer is deposited before TSV filling in order to eliminate the front-side CMP process, which will lower the fabrication cost. Basic electrical tests of…

Edisi
-
ISBN/ISSN
0894-6507
Deskripsi Fisik
-
Judul Seri
-
No. Panggil
-
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cover
Autonomous Student Experiences in Outdoor and Adventure Education
Komentar Bagikan
Brad Daniel [et.al.]

This article explores the current state of knowledge regarding the use of autonomous student experiences (ASE) in outdoor and adventure education (OAE) programs. ASE are defined as components (e.g., solo, final expedition) in which participants have a greater measure of choice and control over the planning, execution, and outcomes of their learning. The article discusses the importance of ASE i…

Edisi
Vol. 37(1) 4– 17
ISBN/ISSN
DOI: 10.1177/1053825
Deskripsi Fisik
Journal of Experiential Education 2014,
Judul Seri
Journal of Experiential Education
No. Panggil
-
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cover
Enhancement of the Virtual Metrology Performance for Plasma-Assisted Oxide Et…
Komentar Bagikan
Seolhye Park [et.al.]

Abstract Virtual metrology (VM) model based on plasma information (PI) parameter for C4F8 plasma-assisted oxide etching processes is developed to predict and monitor the process results such as an etching rate with improved performance. To apply fault detection and classification or advanced process control models on to the real-mass production lines efficiently, high-performance VM model is …

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894–6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
No. Panggil
-
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cover
Effect of Plasma Process for SiO2 Film on Sidewall
Komentar Bagikan
Tatsuhiko Tanimura [et.al.]

Abstract We evaluated the physical and electrical characteristics of SiO2 treated by plasma oxidation on top and sidewall. The plasma process is less effective for SiO2 on sidewall than on top and further less for small pattern. Both the characteristics for SiO2 on sidewall are sensitive to plasma condition in deposition sequence, while not for SiO2 on top. When the plasma process is used as …

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
No. Panggil
-
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cover
GB virus C infection in Indonesian HIV‐positive patients
Komentar Bagikan
Nungki Anggorowati [ et.al.]

GB virus C (GBV‐C), a human virus of the Flaviviridae family that is structurally and epidemiologically closest to hepatitis C virus (HCV), has been reported to confer beneficial outcomes in HIV‐positive patients.However, the prevalence of GBV‐C in HIV‐positive individuals in Indonesia is unknown. Since GBV‐C is more prevalent in anti‐HCV positive patients than in anti‐HCV negativ…

Edisi
2013; 57: 298–308
ISBN/ISSN
Doi: 10.1111/1348-04
Deskripsi Fisik
Microbiol Immunol 2013; 57: 298–308
Judul Seri
Microbiol Immunol
No. Panggil
-
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Unduh MARCSitasi
cover
High-Volume Processed, ITO-Free Superstrates and Substrates for Roll-to-Roll …
Komentar Bagikan
Markus Hösel [et.al.]

The fabrication of substrates and superstrates prepared by scalable roll-toroll methods is reviewed. The substrates and superstrates that act as the fl exible carrier for the processing of functional organic electronic devices are an essential component, and proposals are made about how the general availability of various forms of these materials is needed to accelerate the development of the f…

Edisi
2014, 1, 1400002
ISBN/ISSN
DOI: 10.1002/advs.20
Deskripsi Fisik
Anvanced Science 2014
Judul Seri
Anvanced Science
No. Panggil
-
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Unduh MARCSitasi
cover
Laboratory Safety for Oncogene-Containing Retroviral Vectors
Komentar Bagikan
John T. Gray

The use of retroviral vectors in research laboratories has been steadily increasing, and with that, questions are arising more frequently regarding the biosafety of these reagents, particularly when the vector delivers a gene with oncogenic properties. Although modern retroviral vector systems produce particles that are replication-defective, there is still a possibility that upon accidental …

Edisi
Vol. 16, No. 4, 2011
ISBN/ISSN
-
Deskripsi Fisik
Applied Biosafety Vol. 16, No. 4, 2011
Judul Seri
Applied Biosafety
No. Panggil
-
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Unduh MARCSitasi
cover
A Glyphosate-Resistant Biotype of Annual Bluegrass in Tennessee
Komentar Bagikan
James T. BrosnanGregory K. BreedenThomas C. Mueller

Glyphosate is regularly used to control annual bluegrass populations in dormant bermudagrass turf. A population of annual bluegrass not controlled by glyphosate at 840 g ha-1 (glyphosate resistant, GR) was identified on a golf course in Humboldt, TN in 2010. Mature tillers of GR plants were established in a greenhouse and treated with glyphosate at 0, 210, 420, 840, 1,680, 3,360, and 6,720 g ha…

Edisi
2012 60
ISBN/ISSN
DOI: 10.1614/WS-D-11
Deskripsi Fisik
Weed Science 2012 60:97–100
Judul Seri
Weed Science
No. Panggil
-
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Unduh MARCSitasi
cover
Design of a Decentralized Controller for a Glass RTP System
Komentar Bagikan
Byeong Hyeon Lee [et.al.]

Abstract The design of a decentralized controller has been studied as an integral part of the development of a commercial rapid thermal processing (RTP) system for manufacturing display glass. The glass RTP system uses bulb-type tungsten-halogen lamps for heating. A highly uniform temperature distribution with a maximum temperature difference of less than 6 ◦C between any two points is requi…

Edisi
VOL. 29, NO. 1, FEBRUARY 2016
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016
No. Panggil
-
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Unduh MARCSitasi
cover
Demand Modeling With Forecast Evolution: An Application to Production Planning
Komentar Bagikan
Erinc Albey [et.al.]

Abstract The value of demand forecast information has been the subject of numerous studies in the inventory literature, but has had limited application in production planning. This paper integrates ideas from forecast evolution and inventory theory to plan work releases into a production facility in the face of stochastic demand. The model, which is solved on a rolling horizon basis, manages …

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
No. Panggil
-
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cover
Data Mining for Significance in Yield-Defect Correlation Analysis
Komentar Bagikan
Uwe HessingerWendy K. ChanBrett T. Schafman

Abstract A yield analysis method using basic yield and in-line defect information in a statistical model to determine root-causes of yield loss in semiconductor manufacturing is presented. The goal of this analysis method is to provide the fab process line management yield loss accounting for defects identified at inspected process layers. Quantifying these losses, in terms of yield loss perce…

Edisi
VOL. 27, NO. 3, AUGUST 2014
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 27, NO. 3, AUGUST 2014
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 27, NO. 3, AUGUST 2014
No. Panggil
-
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cover
Correlational Study Between SiN Etch Rate and Plasma Impedance in Electron Cy…
Komentar Bagikan
Takeshi Ohmori [et.al.]

Abstract The correlation between the change in the etching rate of SiN and the change in the monitored plasma impedance was investigated to estimate the capability of critical dimension (CD) prediction with a plasma impedance monitor (PIM). The results obtained with the PIM were compared with those of optical emission spectroscopy (OES), which was performed using the emission intensity ratio …

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
No. Panggil
-
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cover
Control of Epitaxial Growth of SiGe
Komentar Bagikan
Raymond van Roijen [et.al.]

Abstract Silicon-Germanium (SiGe), used to boost pFET performance and enhance the properties of high-k metal gate devices, is grown by selective epitaxy on silicon. Since device parameters depend critically on the deposited SiGe thickness, we apply several advanced techniques to control deposition. Feedback and feed-forward of growth rate data is used to control deposition tools. We also appl…

Edisi
VOL. 28, NO. 4, NOVEMBER 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
No. Panggil
-
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cover
Contact Chains for FinFET Technology Characterization
Komentar Bagikan
Tomasz Brozek [et.al.]

Abstract Electrical characterization remains a key element in technology development and manufacturing of integrated circuits. Contact chain is a well known part of the diagnostic set of test structures used across many generations of silicon processes. Implementation of such test structures becomes challenging in new technologies with 3-D devices, like FinFET. Contacts to active regions of su…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
No. Panggil
-
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Unduh MARCSitasi
cover
Carrier Profiling Technology in Ten Nanometers Devices
Komentar Bagikan
Jun Hirota [et.al.]

Abstract The advanced carrier concentration evaluation scheme was proposed with combined higher precise scanning spreading resistance microscopy (SSRM) measurement and technology-CAD (TCAD) analysis in this paper. The cyclic contact (CC) method was applied to variation reduction of SSRM resistance to more accurately characterize for the device. The CC method suppresses dust generation. The va…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
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cover
Analysis of Temperature Distribution in Stacked IC With On-Chip Sensing Devic…
Komentar Bagikan
Toshihiro Matsuda [et.al.]

Abstract Temperature distributions in 3-D integrated circuits (ICs) are analyzed with a test structure, which has a top-tier chip attached on a bottom dummy chip with adhesive layer. The devices with four kinds of top-tier chip thickness tSi of 50–410 μm were fabricated by a standard 0.18 μm CMOS process. The test structure consists of 24 sensor blocks, each of which has sensor p-n diodes…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
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Analysis and Characterization of Capacitance Variation Using Capacitance Meas…
Komentar Bagikan
Peiyong Zhang [et.al.]

Abstract To address the need for direct extraction of the capacitance of a chip, a capacitance measurement array (CMA) has been developed. The operation of the CMA is based on the charge-based capacitance measurement (CBCM) technique. The CMA chip consists of 144 CBCM array units (CAU) and each CAU is designed to measure eight individual capacitors. Element selection and precise measurement ar…

Edisi
VOL. 27, NO. 2, MAY 2014
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 27, NO. 2, MAY 2014
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 27, NO. 2, MAY 2014
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Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing
Komentar Bagikan
Masayoshi Kumagai [et.al.]

Abstract “Stealth dicing (SD)” was developed to solve inherent problems of a dicing process such as debris contaminants and unnecessary thermal damages on a work wafer. A completely dry process is another big advantage over other dicing methods. In SD, the laser beam power of transmissible wavelength is absorbed only around focal point in the wafer by utilizing the temperature dependence o…

Edisi
VOL. 20, NO. 3, AUGUST 2007
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 20, NO. 3, AUGUST 2007
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 20, NO. 3, AUGUST 2007
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A Regularized Singular Value Decomposition-Based Approach for Failure Pattern…
Komentar Bagikan
Byunghoon Kim [et.al.]

Abstract In semiconductor manufacturing processes, monitoring the quality of wafers is one of the most important steps to quickly detect process faults and significantly reduce yield loss. Fail bit maps (FBMs) represent the failed cell count during wafer functional tests and have been popularly used as one of the diagnosis tools in semiconductor manufacturing for process monitoring, root caus…

Edisi
VOL. 28, NO. 1, FEBRUARY 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 1, FEBRUARY 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 1, FEBRUARY 2015
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A Plasticity-Based Model of Material Removal in Chemical–Mechanical Polishi…
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Guanghui Fu [et.al.]

Abstract It is well known that the chemical reaction between an oxide layer and a water-based slurry produces a softer hydroxylated interface layer. During chemical–mechanical polishing (CMP), it is assumed that material removal occurs by the plastic deformation of this interface layer. In this paper, the behavior of the hydroxylated layer is modeled as a perfectly plastic material, and a me…

Edisi
VOL. 14, NO. 4, NOVEMBER 2001
ISBN/ISSN
0894–6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 14, NO. 4, NOVEMBER 2001
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 14, NO. 4, NOVEMBER 2001
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A New Etch Planarization Technology to Correct Non-Uniformity Post Chemical M…
Komentar Bagikan
Meihua Shen [et.al.]

Abstract The introduction of 3-D structures and new materials for advanced logic devices at extremely fine feature size presents challenges for within-wafer and wafer-to-wafer thickness uniformity control that is critical for yield and performance. For conventional chemical mechanical polishing technology, the typical thin film uniformity across the whole wafer may not meet the desired variat…

Edisi
VOL. 28, NO. 4, NOVEMBER 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 4, NOVEMBER 2015
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A New Accelerated Endurance Test for Terabit NAND Flash Memory Using Interfer…
Komentar Bagikan
Jaewon Cha [et.al.]

Abstract Limited endurance of E/W cycles is a unique restriction of flash memories and the endurance characteristics usually take a longer time to test. In this paper, we proposed a novel endurance test scheme that takes advantage of the parasitic cell-to-cell interference as well as a shortened program time to accelerate the endurance test for terabit NAND flash memory. The novelty of the ne…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
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A Discharge-Based Pulse Technique for Probing the Energy Distribution of Posi…
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Riu Gao, Zhigang Ji [et.al.]

Abstract Characterizing positive charges and its energy distribution in gate dielectric is useful for process qualification. A discharge-based technique is introduced to extract their energy distribution both within and beyond substrate band-gap. This paper investigates the difficulties in its implementation on typical industrial parameter analyzer and provides solutions. For the first time, w…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
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-
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A Compact Test Structure for Characterizing Transistor Variability Beyond 3σ
Komentar Bagikan
Christopher S. Chen [et.al.]

Abstract An addressable array test structure is proposed for characterization of transistor variability beyond 3σ away from the mean. The design of the array is based on very compact basic cells which enable a highly efficient layout which has over three times higher normalized device density than similar arrays. Implementations of a 32k array are demonstrated for placement in a standard waf…

Edisi
VOL. 28, NO. 3, AUGUST 2015
ISBN/ISSN
0894-6507
Deskripsi Fisik
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
Judul Seri
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015
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Implications of bacterial contaminated seed lots and endophytic colonization …
Komentar Bagikan
D. L. Adorada [et.al.]

The economic impact of seedborne bacterial diseases on rice production provides a major motivation for research on seed health. This paper reports on the endophytic growth of a rifampicin-marked strain of the seedborne rice pathogen Pseudomonas fuscovaginae. The bacterium was found in most tested seeds indicating that, even without visible discolouration, seed transmission is possible. Crushed …

Edisi
(2015) 64, 43–50
ISBN/ISSN
Doi: 10.1111/ppa.122
Deskripsi Fisik
Plant Pathology (2015) 64, 43–50
Judul Seri
Plant Pathology
No. Panggil
-
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Prioritizing Regions to Conserve a Specialist Folivore: Considering Probabili…
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Christine Adams-Hosking [et.al.]

Abstract For species that are increasingly threatened by the combined impacts of habitat loss and climate change, the identification of priority regions for conservation planning efforts is urgently required. In the case of specialist folivores, consideration of the effects of climate change on the distributions of their essential food resources should be a key component of conservation planni…

Edisi
2015, 8(3)
ISBN/ISSN
doi: 10.1111/conl.12
Deskripsi Fisik
Conservation Letters, May/June 2015, 8(3), 162–170
Judul Seri
Conservation Letters
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Dna sequencing, anatomy, and calcification patterns support a Monophyletic, s…
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Walter H. Adey [et.al.]

For the first time, morpho-anatomical characters that were congruent with DNA sequence data were used to characterize several genera in Hapalidiaceae —the major eco-engineers of Subarctic carbonate ecosystems. DNA sequencing of three genes (SSU, rbcL, ribulose-1, 5-bisphosphate carboxylase/ oxygenase large subunit gene and psbA, photosystem II D1 protein gene), along with patterns of cell …

Edisi
-
ISBN/ISSN
DOI: 10.1111/jpy.122
Deskripsi Fisik
J. Phycol. 51, 189–203 (2015)
Judul Seri
Phycological Society
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Planning Across Freshwater and Terrestrial Realms: Cobenefits and Tradeoffs B…
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Vanessa M. Adams [et.al.]

Conservation planning has historically been restricted to planning within single realms (i.e., marine, terrestrial, or freshwater). Recently progress has been made in approaches for cross-realm planning which may enhance the ability to effectively manage processes that sustain biodiversity and ecosystem functions (e.g., connectivity) and thus minimize threats more efficiently. Current advances…

Edisi
2014, 7(5)
ISBN/ISSN
doi: 10.1111/conl.12
Deskripsi Fisik
Conservation Letters, September/October 2014, 7(5), 425–440
Judul Seri
Conservation Letters
No. Panggil
-
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Unduh MARCSitasi
cover
Standardizing immunophenotyping for the Human Immunology Project
Komentar Bagikan
Holden T. Maecker [et al.]

The heterogeneity in the healthy human immune system, and the immunological changes that portend various diseases, have been only partially described. Their comprehensive elucidation has been termed the ‘Human Immunology Project’. The accurate measurement of variations in the human immune system requires precise and standardized assays to distinguish true biological changes from technical a…

Edisi
12(3): 191–200.
ISBN/ISSN
doi:10.1038/nri3158.
Deskripsi Fisik
Nat Rev Immunol. ; 12(3): 191–200. doi:10.1038/nri3158.
Judul Seri
Nat Rev Immunol.
No. Panggil
-
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Routing Algorithms for Network Function Virtualization Enabled Multicast Topo…
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Sai Qian Zhang [et.al.]

Abstract Many multicast services such as live multimedia distribution and real-time event monitoring require multicast mechanisms that involve network functions (e.g., firewall and video transcoding). Network function virtualization (NFV) is a concept that proposes using virtualization to implement network functions on infrastructure building block (such as high volume servers and virtual mac…

Edisi
-
ISBN/ISSN
1932-4537
Deskripsi Fisik
IEEE TRANSACTIONS ON NETWORK AND SERVICE MANAGEMENT, VOL. 12, NO. 4, DECEMBER 2015
Judul Seri
IEEE TRANSACTIONS ON NETWORK AND SERVICE MANAGEMENT, VOL. 12, NO. 4, DECEMBER 2015
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Classification of Korean forests: patterns along geographic and environmental…
Komentar Bagikan
Tomasˇ Cerny [et.al.]

Abstract Aim: To describe the main vegetation types of the Korean zonal forests and explore their relationship with the main environmental and geographic gradients. Location: Korean Peninsula. Methods: A data set of 3847 releves of zonal (semi)natural forest stands, together with environmental factors recorded in the field or derived from interpolated climatic data was collected. Using the…

Edisi
Vo. 18 (2015)
ISBN/ISSN
Doi: 10.1111/avsc.12
Deskripsi Fisik
Applied Vegetation Science 18 (2015) 5–22
Judul Seri
Applied Vegetation Science
No. Panggil
-
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cover
Flow-Based Management For Energy Efficient Campus Networks
Komentar Bagikan
Ahmed Amokrane [et.al.]

Abstract Recent studies have shown that the energy consumption of wireless access networks is a threat to the sustainability of mobile cloud services. Consequently, energy efficient solutions are becoming crucial for both local and wireless access networks. In this paper, we propose a flow-based management framework to achieve energy efficiency in campus networks. We address the problem from …

Edisi
-
ISBN/ISSN
1932-4537
Deskripsi Fisik
IEEE TRANSACTIONS ON NETWORK AND SERVICE MANAGEMENT, VOL. 12, NO. 4, DECEMBER 2015
Judul Seri
IEEE TRANSACTIONS ON NETWORK AND SERVICE MANAGEMENT, VOL. 12, NO. 4, DECEMBER 2015
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An Effective Web Service Ranking Method via Exploring User Behavior
Komentar Bagikan
Guosheng Kang [et.al.]

Abstract Service-oriented computing and Web services are becoming more and more popular, enabling organizations to use the Web as a market for selling their own Web services and consuming existing Web services from others. Nevertheless, with the increasing adoption and presence of Web services, it becomes more difficult to find the most appropriate Web service that satisfies both users’ func…

Edisi
-
ISBN/ISSN
1932-4537
Deskripsi Fisik
IEEE TRANSACTIONS ON NETWORK AND SERVICE MANAGEMENT, VOL. 12, NO. 4, DECEMBER 2015
Judul Seri
IEEE TRANSACTIONS ON NETWORK AND SERVICE MANAGEMENT, VOL. 12, NO. 4, DECEMBER 2015
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ATFQ: A Fair and Efficient Packet Scheduling Method in Multi-Resource Environ…
Komentar Bagikan
Jianhui Zhang [et.al.]

Abstract Large-scale data centers are the key infrastructures for hosting and running a variety of applications. Besides traditional L2/L3 devices, middleboxes are widely deployed in data centers and perform many important functions, e.g., the intrusion detection and firewall. Middleboxes are equipped with multiple kinds of resources, such as CPU and memory. Data flows undergoing different fu…

Edisi
-
ISBN/ISSN
1932-4537
Deskripsi Fisik
IEEE TRANSACTIONS ON NETWORK AND SERVICE MANAGEMENT, VOL. 12, NO. 4, DECEMBER 2015
Judul Seri
IEEE TRANSACTIONS ON NETWORK AND SERVICE MANAGEMENT, VOL. 12, NO. 4, DECEMBER 2015
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Design, Modeling, and Simulation of On-Demand Communication Mechanisms for Cy…
Komentar Bagikan
Ehsan Moradi-Pari [ert.al.]

Abstract Advanced communication technology is the enabling factor for distributed sensing and control in smart grid. The performance of communication has a significant effect on the performance of the controllers that manage a power system. This effect is more profound when transient level behavior and critical applications are concerned. In these cases, an important issue is to design contro…

Edisi
-
ISBN/ISSN
1551-3203
Deskripsi Fisik
IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, VOL. 10, NO. 4, NOVEMBER 2014
Judul Seri
IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, VOL. 10, NO. 4, NOVEMBER 2014
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