Process Development and Optimization for 3 μm High Aspect Ratio Via-Middle T…

Abstract—This paper presents challenges encountered in the fabrication of high aspect ratio (AR) via middle, through-silicon vias (TSVs), of 3 μm top entrant critical dimension and 50 μm depth. Higher AR TSV integration is explored due to the lower stress and copper pumping influence of TSVs observed in adjacent CMOS devices. The key process improvements demonstrated in this paper include 3…

Particle Transport in Etching Chamber Influenced by Coulomb Force

Edisi

VOL. 28, NO. 3, AUGUST 2015

ISBN/ISSN

0894-6507

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 28, NO. 3, AUGUST 2015

No. Panggil

-

Particle Reduction and Control in Plasma Etching Equipment

Abstract—Particles within plasma etching equipment stick to the wafer and cause defects, resulting in large scale integrated circuit (LSI) yield reduction.We observed the behavior of particles resuspended in a vacuum chamber using a laser light scattering method. Investigating the influences of gases, static electricity, and plasma on particle resuspension, we found out that particles are no…

Optimization of Re-Entrant Hybrid Flows With Multiple Queue Time Constraints …

Abstract—This paper proposes optimization methods of re-entrant hybrid flows with multiple queue time constraints in batch processes of semiconductor manufacturing. A smoothing flow concept and a dispatching rule for the re-entrant flows called “re-entrant flow smoothing” [REFS(X)] and a loading rule for the processes with multiple queue time constraints called “synchronized control of…

Novel Approaches to Optimizing Carrier Logistics in Semiconductor Manufacturing

Abstract—This paper provides an overview of new approaches for assessing and addressing requirements for carrier logistics in semiconductor manufacturing and discusses solutions for optimizing the efficiency of capital equipment installed in the fab. An exploration of crucial influencing factors (both on the material handling as well as on the equipment side) will be followed by a discussion …

Non-Contact, Sub-Surface Detection of Alloy Segregation in Back-End of Line C…

Abstract—Alloy seedlayers for copper back-end of line interconnects have become common at technology groundrules of 45 nm and below, due to reliability requirements. The key requirement of the minority alloy component (e.g., Al or manganese, also referred to as the “dopant”) is that it segregates to the copper (Cu)/dielectric cap layer interface in order to promote adhesion between the C…

Modeling and Optimal Design of a Glass RTP System

Abstract—The problem of modeling and generating an optimal design of a rapid thermal processing (RTP) system for flat panel display glass was addressed. An RTP system using bulb-type tungsten-halogen lamps was considered, and a dynamic model to describe the glass temperature distribution was established. The power dispersion function comprising the model was established in an experimental R…

Measuring the Manufacturing Yield for Skewed Wire Bonding Processes

Abstract In semiconductor manufacturing, the technologies of stacked semiconductor packaging are important miniaturization strategies in which excellent quality is essential for a good reputation. Yield-based index Cpk has been the most popular tool for successful quality improvement activities and quality program implementation in multichip package processes. For in-plant applications, quali…

Measurement and Analysis of Seismic Response in Semiconductor Manufacturing E…

Abstract In this paper, a cost-effective, easy-install and fast measurement and analysis method to obtain seismic response of semiconductor manufacturing equipments was developed and its validity was discussed. In the developed method, micro-vibration measurement experiments are first carried out to obtain transfer functions and coherence functions from the floor to arbitrary part of equipment…

Manufacturing Yield for Multiple Lines Gold Bumping Processes With Asymmetric…

Abstract Development of touch display driver IC (TDDI) has enabled slimmer smartphone design by virtue of the integration of touch controller and display driver ICs (DDIs) into a single chip. TDDI plays an important role in touch integrated display panels. Compared to conventional DDI, TDDI requires more bonding pads for touch applications, thus increasing the usage of gold. The requirement to…

Manufacturing Challenges of GaN-on-Si HEMTs in a 200mm CMOS Fab

Abstract In this paper, we report on the challenges related to growth and processing of 200mm GaN-on-Si wafers in a CMOS fab. We describe the Au free process we developed as well as how we assure wafer quality prior processing. For the first time, we analyze possible Ga contamination issues related to the processing of GaN wafers and we present the cleaning procedures we developed to avoid it…

In Search of “Forever,” Continued Transistor Scaling One New Material at …

Abstract This work looks at past, present, and future material changes for the metal–oxide–semiconductor field-effect transistor (MOSFET). It is shown that conventional planar bulk MOSFET channel length scaling, which has driven the industry for the last 40 years, is slowing. To continue Moore’s law, new materials and structures are required. The first major material change to extend Moo…

Implementation of Tungsten Metallization In Multilevel Interconnection Techno…

Abstract The techniques of experimental design and response-surface methodology have been used to produce empirical models of the deposition and etchback of tungsten in commercially available reactors for a tungsten plug technology. Deposition was carried out in a Genus 8402 LPCVD batch reactor by the Hz reduction of WF,. Responsesurfaces for deposition rate, sheet resistance uniformity, resi…

Impacts of Differences in Epidemiological Case Definitions on Prevalence for …

evaluate prevalence based on variations in case definitions used for epidemiological studies of musculoskeletal disorders (MSDs). Background: Prior studies of MSDs have mostly relied on a single case definition based on questionnaires. Method: In a multicenter prospective cohort study, we systematically collected data to evaluate impacts of differences in case definitions of MSDs on prevalenc…

Health Index Extraction Methods for Batch Processes in Semiconductor Manufact…

Abstract This paper deals with a study of three methods for health index (HI) extraction in semiconductor manufacturing equipments. The first method uses degradation reconstruction-based identification with basic principal component analysis (PCA), the second one uses multiway PCA and the last one extracts HI from the significant points related to degradation. A comparison of these methods are…

Full-Wafer Voltage Contrast Inspection for Detection of BEOL Defects

Abstract This paper details an application where E-beam inspection (EBI) can be used for 100% full wafer inspection, generally considered a mythical target for EBI. For process layers where the line-widths and defects of interest are large, very large pixel size and high scan frequency can be used, thereby making full wafer inspection feasible. The metal layers in the back-endof-line fit this …

Fluorocarbon Chemistry: A 0-Dimensional Model for Oxide and Nitride Dry Etching

Abstract In this paper, a 0-dimensional model for the understanding of dry etching characteristics in silicon oxide and nitride materials is reported. The model is applied to analyze the etching performances in a design of experiments where gas mixtures are varied in the fluorocarbon chemistry typical of the “protected sidewall” regime. The modeling analysis of flat sample etching allows f…

The Association Between Combination of Hand Force and Forearm Posture and Inc…

Objective: The objective of this prospective study is to investigate the exposure–response relationships between various workplace physical exposures of force, repetition, and their combination assessed at an individual level with lateral epicondylitis (LE). Background: Workplace upper extremity musculoskeletal disorders (UEMSDs) are prevalent, disabling, and expensive. LE is one of the majo…

Flexible Pressure Sensors Based on Screen-Printed P(VDF-TrFE) and P(VDF-TrFE)…

Abstract This paper presents large-area-printed flexible pressure sensors developed with an all screen-printing technique. The 4 × 4 sensing arrays are obtained by printing polyvinylidene fluoride-trifluoroethylene P(VDF-TrFE) and their nanocomposite with multi-walled carbon nanotubes (MWCNTs) and are sandwiched between printed metal electrodes in a parallel plate structure. The bottom electr…

Efficacy of the Revised NIOSH Lifting Equation to Predict Risk of Low-Back Pa…

Objective: The objective was to evaluate the efficacy of the Revised National Institute for Occupational Safety and Health (NIOSH) lifting equation (RNLE) to predict risk of low-back pain (LBP). Background: In 1993, NIOSH published the RNLE as a risk assessment method for LBP associated with manual lifting. To date, there has been little research evaluating the RNLE as a predictor of the risk…

The NIOSH Lifting Equation and Low-Back Pain, Part 2: Association With Seeki…

Objective: The aim of this study was to investigate the relationship between the revised NIOSH lifting equation (RNLE) and risk of seeking care for low-back pain (SC-LBP). Background: The RNLE is commonly used to quantify low-back physical stressors from lifting/lowering of loads in workplaces. There is no prospective study on relationship between RNLE and SC-LBP. Method: A cohort of 258 inci…

The State of Knowledge of Outdoor Orientation Programs: Current Practices, Re…

Outdoor orientation programs represent a prominent area of experiential education with over 25,000 participants annually. More than 191 outdoor orientation programs currently operate in the United States and Canada. The research examining outdoor orientation programs consists of 25 peer-reviewed published studies and 11 dissertations. A new theory explaining the success of these programs has em…

Comparing the surgical timelines of military and civilians traumatic lower li…

The care and challenges of injured service have been well documented in the literature from a variety of specialities. The aim of this study was to analyse the surgical timelines of military and civilian traumatic amputees and compare the surgical and resuscitative interventions. A retrospective review of patient notes was undertaken. Military patients were identified from the Joint Theatr…

The NIOSH Lifting Equation and Low-Back Pain, Part 1: Association With Low-Ba…

Objective: The aim of this study was to evaluate relationships between the revised NIOSH lifting equation (RNLE) and risk of low-back pain (LBP). Background: The RNLE is commonly used to quantify job physical stressors to the low back from lifting and/or lowering of loads. There is no prospective study on the relationship between RNLE and LBP that includes accounting for relevant covariates.…

Fast Scheduling of Semiconductor Manufacturing Facilities Using Case-Based Re…

Edisi

VOL. 29, NO. 1, FEBRUARY 2016

ISBN/ISSN

0894-6507

Deskripsi Fisik

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 29, NO. 1, FEBRUARY 2016

No. Panggil

-

Fabrication, Characterization, and Simulation of a Low-cost TSV Integration w…

Abstract In this study, a low-cost through-multilayer TSV integration process has been developed. The features are that a double-layer spin coating technique is applied to prevent residual photoresist left inside TSVs. Besides, redistribution layer is deposited before TSV filling in order to eliminate the front-side CMP process, which will lower the fabrication cost. Basic electrical tests of…

Autonomous Student Experiences in Outdoor and Adventure Education

This article explores the current state of knowledge regarding the use of autonomous student experiences (ASE) in outdoor and adventure education (OAE) programs. ASE are defined as components (e.g., solo, final expedition) in which participants have a greater measure of choice and control over the planning, execution, and outcomes of their learning. The article discusses the importance of ASE i…

Enhancement of the Virtual Metrology Performance for Plasma-Assisted Oxide Et…

Abstract Virtual metrology (VM) model based on plasma information (PI) parameter for C4F8 plasma-assisted oxide etching processes is developed to predict and monitor the process results such as an etching rate with improved performance. To apply fault detection and classification or advanced process control models on to the real-mass production lines efficiently, high-performance VM model is …

Effect of Plasma Process for SiO2 Film on Sidewall

Abstract We evaluated the physical and electrical characteristics of SiO2 treated by plasma oxidation on top and sidewall. The plasma process is less effective for SiO2 on sidewall than on top and further less for small pattern. Both the characteristics for SiO2 on sidewall are sensitive to plasma condition in deposition sequence, while not for SiO2 on top. When the plasma process is used as …

GB virus C infection in Indonesian HIV‐positive patients

GB virus C (GBV‐C), a human virus of the Flaviviridae family that is structurally and epidemiologically closest to hepatitis C virus (HCV), has been reported to confer beneficial outcomes in HIV‐positive patients.However, the prevalence of GBV‐C in HIV‐positive individuals in Indonesia is unknown. Since GBV‐C is more prevalent in anti‐HCV positive patients than in anti‐HCV negativ…

High-Volume Processed, ITO-Free Superstrates and Substrates for Roll-to-Roll …

The fabrication of substrates and superstrates prepared by scalable roll-toroll methods is reviewed. The substrates and superstrates that act as the fl exible carrier for the processing of functional organic electronic devices are an essential component, and proposals are made about how the general availability of various forms of these materials is needed to accelerate the development of the f…

Laboratory Safety for Oncogene-Containing Retroviral Vectors

The use of retroviral vectors in research laboratories has been steadily increasing, and with that, questions are arising more frequently regarding the biosafety of these reagents, particularly when the vector delivers a gene with oncogenic properties. Although modern retroviral vector systems produce particles that are replication-defective, there is still a possibility that upon accidental …

A Glyphosate-Resistant Biotype of Annual Bluegrass in Tennessee

Glyphosate is regularly used to control annual bluegrass populations in dormant bermudagrass turf. A population of annual bluegrass not controlled by glyphosate at 840 g ha-1 (glyphosate resistant, GR) was identified on a golf course in Humboldt, TN in 2010. Mature tillers of GR plants were established in a greenhouse and treated with glyphosate at 0, 210, 420, 840, 1,680, 3,360, and 6,720 g ha…

Design of a Decentralized Controller for a Glass RTP System

Abstract The design of a decentralized controller has been studied as an integral part of the development of a commercial rapid thermal processing (RTP) system for manufacturing display glass. The glass RTP system uses bulb-type tungsten-halogen lamps for heating. A highly uniform temperature distribution with a maximum temperature difference of less than 6 ◦C between any two points is requi…

Demand Modeling With Forecast Evolution: An Application to Production Planning

Abstract The value of demand forecast information has been the subject of numerous studies in the inventory literature, but has had limited application in production planning. This paper integrates ideas from forecast evolution and inventory theory to plan work releases into a production facility in the face of stochastic demand. The model, which is solved on a rolling horizon basis, manages …

Data Mining for Significance in Yield-Defect Correlation Analysis

Abstract A yield analysis method using basic yield and in-line defect information in a statistical model to determine root-causes of yield loss in semiconductor manufacturing is presented. The goal of this analysis method is to provide the fab process line management yield loss accounting for defects identified at inspected process layers. Quantifying these losses, in terms of yield loss perce…

Correlational Study Between SiN Etch Rate and Plasma Impedance in Electron Cy…

Abstract The correlation between the change in the etching rate of SiN and the change in the monitored plasma impedance was investigated to estimate the capability of critical dimension (CD) prediction with a plasma impedance monitor (PIM). The results obtained with the PIM were compared with those of optical emission spectroscopy (OES), which was performed using the emission intensity ratio …

Control of Epitaxial Growth of SiGe

Abstract Silicon-Germanium (SiGe), used to boost pFET performance and enhance the properties of high-k metal gate devices, is grown by selective epitaxy on silicon. Since device parameters depend critically on the deposited SiGe thickness, we apply several advanced techniques to control deposition. Feedback and feed-forward of growth rate data is used to control deposition tools. We also appl…

Contact Chains for FinFET Technology Characterization

Abstract Electrical characterization remains a key element in technology development and manufacturing of integrated circuits. Contact chain is a well known part of the diagnostic set of test structures used across many generations of silicon processes. Implementation of such test structures becomes challenging in new technologies with 3-D devices, like FinFET. Contacts to active regions of su…

Carrier Profiling Technology in Ten Nanometers Devices

Abstract The advanced carrier concentration evaluation scheme was proposed with combined higher precise scanning spreading resistance microscopy (SSRM) measurement and technology-CAD (TCAD) analysis in this paper. The cyclic contact (CC) method was applied to variation reduction of SSRM resistance to more accurately characterize for the device. The CC method suppresses dust generation. The va…

Analysis of Temperature Distribution in Stacked IC With On-Chip Sensing Devic…

Abstract Temperature distributions in 3-D integrated circuits (ICs) are analyzed with a test structure, which has a top-tier chip attached on a bottom dummy chip with adhesive layer. The devices with four kinds of top-tier chip thickness tSi of 50–410 μm were fabricated by a standard 0.18 μm CMOS process. The test structure consists of 24 sensor blocks, each of which has sensor p-n diodes…

Analysis and Characterization of Capacitance Variation Using Capacitance Meas…

Abstract To address the need for direct extraction of the capacitance of a chip, a capacitance measurement array (CMA) has been developed. The operation of the CMA is based on the charge-based capacitance measurement (CBCM) technique. The CMA chip consists of 144 CBCM array units (CAU) and each CAU is designed to measure eight individual capacitors. Element selection and precise measurement ar…

Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing

Abstract “Stealth dicing (SD)” was developed to solve inherent problems of a dicing process such as debris contaminants and unnecessary thermal damages on a work wafer. A completely dry process is another big advantage over other dicing methods. In SD, the laser beam power of transmissible wavelength is absorbed only around focal point in the wafer by utilizing the temperature dependence o…

A Regularized Singular Value Decomposition-Based Approach for Failure Pattern…

Abstract In semiconductor manufacturing processes, monitoring the quality of wafers is one of the most important steps to quickly detect process faults and significantly reduce yield loss. Fail bit maps (FBMs) represent the failed cell count during wafer functional tests and have been popularly used as one of the diagnosis tools in semiconductor manufacturing for process monitoring, root caus…

A Plasticity-Based Model of Material Removal in Chemical–Mechanical Polishi…

Abstract It is well known that the chemical reaction between an oxide layer and a water-based slurry produces a softer hydroxylated interface layer. During chemical–mechanical polishing (CMP), it is assumed that material removal occurs by the plastic deformation of this interface layer. In this paper, the behavior of the hydroxylated layer is modeled as a perfectly plastic material, and a me…

A New Etch Planarization Technology to Correct Non-Uniformity Post Chemical M…

Abstract The introduction of 3-D structures and new materials for advanced logic devices at extremely fine feature size presents challenges for within-wafer and wafer-to-wafer thickness uniformity control that is critical for yield and performance. For conventional chemical mechanical polishing technology, the typical thin film uniformity across the whole wafer may not meet the desired variat…

A New Accelerated Endurance Test for Terabit NAND Flash Memory Using Interfer…

Abstract Limited endurance of E/W cycles is a unique restriction of flash memories and the endurance characteristics usually take a longer time to test. In this paper, we proposed a novel endurance test scheme that takes advantage of the parasitic cell-to-cell interference as well as a shortened program time to accelerate the endurance test for terabit NAND flash memory. The novelty of the ne…

A Discharge-Based Pulse Technique for Probing the Energy Distribution of Posi…

Abstract Characterizing positive charges and its energy distribution in gate dielectric is useful for process qualification. A discharge-based technique is introduced to extract their energy distribution both within and beyond substrate band-gap. This paper investigates the difficulties in its implementation on typical industrial parameter analyzer and provides solutions. For the first time, w…

A Compact Test Structure for Characterizing Transistor Variability Beyond 3σ

Abstract An addressable array test structure is proposed for characterization of transistor variability beyond 3σ away from the mean. The design of the array is based on very compact basic cells which enable a highly efficient layout which has over three times higher normalized device density than similar arrays. Implementations of a 32k array are demonstrated for placement in a standard waf…

Implications of bacterial contaminated seed lots and endophytic colonization …

The economic impact of seedborne bacterial diseases on rice production provides a major motivation for research on seed health. This paper reports on the endophytic growth of a rifampicin-marked strain of the seedborne rice pathogen Pseudomonas fuscovaginae. The bacterium was found in most tested seeds indicating that, even without visible discolouration, seed transmission is possible. Crushed …