Quantum mechanics for pedestrians 1 ; fundamentals

Edisi

Second Edition

ISBN/ISSN

9783030004644

Deskripsi Fisik

519 hlm

Judul Seri

-

No. Panggil

-

Analytical and numerical studies on heat transfer of a nanofluid over a stret…

Abstract Background: The objective of the present study is to analyse the steady second-order slip flow and heat transfer of an incompressible viscous water-based nanofluid over a stretching/shrinking sheet both analytically and numerically. Methods: Using the scaling group transformations, a system of partial differential equations governing the flow and thermal fields is transformed into …

Surface characterization of austenitic stainless steel 304L after different g…

Abstract Background: The austenitic stainless steel 304L is widely used as a structural material for which the finished surface has significant effect on the service performance. A study of the grinding process with regard to the quality of the ground surfaces is therefore interesting from the point of view of both industrial application and scientific research. Method: This work investigat…

Effect of heating time of adsorber-collector on the performance of a solar ad…

Abstract This paper presents a numerical study of heat transfer inside the adsorber-collector of a solar adsorption refrigerator using the activated carbon AC35-methanol pair. The objective is to estimate the amount of the heat loss through the adsorber-collector, during the solar heating phase, and to determine the effect of heating time on the thermal efficiency of the system. The numeric…

On the deformation of almost cylindrical elastic beams

Abstract Background: The Saint-Venant problem for porous elastic cylinders is of interest both from the technical and mathematical point of view. The intended applications of solution are to mechanics of bone and to some engineering structures. Method: This work investigates the Saint-Venant problem for almost prismatic bars made of an isotropic porous material. We express the solution in …

Strain and stress conditions at crack initiation during shearing of medium- a…

Abstract Background: Strain and stress conditions in sheet metal shearing are of interest for calibration of various fracture criteria. Most fracture criteria are governed by effective strain and stress triaxiality. Methods: This work is an attempt to extend previous measurements of strain fields in shearing of steel sheets with the stress state calculated from the measured displacement fie…

Performance evaluation of multi-stage open-loop impedance pump

Abstract Background: Impedance pump is a simple valveless pumping mechanism, which transports fluid through the mismatch of impedance in the system. Mismatch in impedance occurs when an asymmetrical periodic excitation is exerted on the elastic tube. Periodic asymmetrical excitation will then produce a unidirectional flow. Considering a multi-stage system with a single and constant power so…

Pulse-Echo Ultrasound Imaging Using an AlN Piezoelectric Micromachined Ultras…

Abstract—This work demonstrates short-range and highresolution ultrasonic imaging using 8 MHz aluminum nitride (AlN) piezoelectric micromachined ultrasonic transducer (PMUT) arrays, which are compatible with complementary metal-oxide semiconductor circuitry and wafer-level mass manufacture. Because AlN has a low dielectric constant, the PMUTs have low capacitance and a custom 1.8 V interface…

Pull-In Voltage and Fabrication Yield Analysis of All-Metal-Based Nanoelectro…

Abstract—We designed a one-mask process for all-molybdenum-based laterally actuated anoelectromechanical switches. The damascene-like process is designed to ensure a smooth, high-aspect ratio, and metal-to-metal mechanical contact. Based on the statistical study of 800 devices, very high process yield can be achieved for fixed–fixed beam devices by selecting suitable device dimensions, i.…

Proportional Control Valves Integrated in Silicon Nitride Surface Channel Tec…

Abstract—We have designed and realized two types of proportional microcontrol valves in a silicon nitride surface channel technology process. This enables on-die integration of flow controllers with other surface channel devices, such as pressure sensors or thermal or Coriolis-based (mass) flow sensors, to obtain a proportional gas flow control system on a single chip. One valve design is imp…

Power Optimization by Mass Tuning for MEMS Piezoelectric Cantilever Vibration…

Abstract—A cantilever with an end mass is one of the most popular designs for piezoelectric MEMS vibration energy harvesting. The inclusion of a proof mass near the free end of a micro-cantilever can significantly enhances the power responsiveness of a vibration energy harvester per unit acceleration. However, the accommodation of the proof mass comes at the expense of the active piezoelectr…

Polymer Gap Adapter for Contactless, Robust, and Fast Measurements at 220–3…

Abstract—Radiation leakages are a considerable problem when measuring waveguide structures at high frequencies. In order to maintain good electrical contact, flanges need to be tightly and evenly screwed to the device under test. This can be a time-consuming operation, especially with repeated measurements. We present a metamaterial-based adapter, which prohibits leakage even in the presence …

Performance Assessment of CMUT Arrays Based on Electrical Impedance Test Results

Abstract—A quantitative quality assessment method for capacitive micromachined ultrasonic transducer (CMUT) arrays based on electrical impedance measurements made at wafer level is proposed. The resonant response in air of CMUTs is described and then used to obtain a quantitative quality value. Several issues that could occur in CMUT arrays as well as their effect on the output of the assess…

Optimization of Reactive Ion Etching of Polycrystalline Diamond for MEMS Appl…

Abstract—It has been found that diamond columns can be formed unintentionally in reactive ion etching (RIE) with O2 plasma even without a precoated metal layer. The experimental results indicate that the existence of these diamond columns prevents the effective removal of polycrystalline diamond (poly-C), also known as microcrystalline diamond. A three-step sequential RIE of poly-C thin film…

Optimization of ICPCVD Amorphous Silicon for Optical MEMS Applications

Abstract—In this paper, we present the optimization of optical and mechanical properties of inductively coupled plasma chemical vapor deposited (ICPCVD) amorphous silicon thin films for fabrication of high-quality optical microelectromechanical systems-based devices operating from visible to short-wave infrared wavelengths (450–3000 nm). Our results indicate that, at relatively high deposi…

Monolithic CMOS—MEMS Pure Oxide Tri-Axis Accelerometers for Temperature Sta…

Abstract—A complementary metal–oxide–semiconductor (CMOS)–microelectromechanical system (MEMS) accelerometer with stacked pure oxide layers as mechanical structures was developed. Metal layers were confined to the sensing electrodes and electrical routings; the metal–oxide composite in the CMOS–MEMS accelerometer was distributed in limited regions. This design has two major advantag…

Modeling of Temperature Effects on Micromachined Silicon Thermal Wind Sensors

Abstract—A 2-D micromachined silicon thermal wind sensor measures wind speed and direction by monitoring temperature differences induced by an airflow that passes along the substrate surface. When ambient temperature changes, however, the temperature drift of the sensor will lead to incorrect output values. By examining the thermophysical properties of the airflow, substrate, and temperature…

Microhydraulic Electrowetting Actuators

Abstract—The conversion of electrical to mechanical power on a sub-centimeter scale is a key technology in many microsystems and energy harvesting devices. In this paper, we present a type of a capacitive energy conversion device that uses capillary pressure and electrowetting to reversibly convert electrical power to hydraulic power. These microhydraulic actuators use a high surface-to-volum…

Microfluidic to Nanofluidic Interface via a Thermally Decomposable Sacrificia…

Abstract—We present an original batch process to connect a bulk microfluidic channel to a surface nanofluidic channel for a wide variety of microfluidic and lab-on-chip applications. The approach relies on a two-step lithography process using a thermally decomposable polynorbornene resist unity to form the sacrificial channel layer. A high aspect ratio silicon via is deep reactive ion etched …

MEMS-Based UHF Monolithic Crystal Filters for Integrated RF Circuits

Abstract—We report our work in developing microelectromechanical systems (MEMS)-based Ultra High Frequency (UHF) AT-cut quartz monolithic crystal filters operating between 350 and 400 MHz for integration with Si electronics for highly compact Radio Frequency (RF) front-end electronics. Our narrow bandwidth (0.2%) high Q filters have measured insertion losses of −2 dB with temperature stabil…

MEMS-Based Tunable Fabry–Perot Filters for Adaptive Multispectral Thermal I…

Abstract—This paper reports on a proof-of-concept microelectromechanical system-based Fabry–Perot filter that is capable of electrically tuning within the long-wave infrared thermal imaging band of 8–12 μm. The device employs a single-layer quarter-wavelength thick tensile germanium membrane for the suspended top mirror in order to achieve nanometer-scale as-released mirror flatness acr…

MEMS Scale PVDF-TrFE-Based Piezoelectric Energy Harvesters

Abstract—This paper presents the design, the fabrication, and the performance characterization of microelectromechanical systems (MEMS) scale cantilever-type piezoelectric energy harvesters (PEHs) that utilize the piezoelectric polymer polyvinylidene fluoride–trifluoroethylene (PVDF-TrFE). Ranges are determined for device dimensions according to the calculations based on mathematical model…

MEMS Nanopositioner for On-Chip Atomic Force Microscopy: A Serial Kinematic D…

Abstract—The design and characterization of a twodegree-of-freedom serial kinematic microelectro mechanical systems (MEMS) nanopositioner for on-chip atomic force microscopy (AFM) is reported. A novel design is introduced to achieve a serial kinematic mechanism based on a standard siliconon-insulator MEMS fabrication process. The nanopositioner comprises a slow axis with a resonance frequency…

Mechanical Interfacing Using Suspended Ultrathin Films From ALD

Abstract—Interlocking microstructures formed from suspended ultrathin films create a mechanical bond between heterogeneous microfabricated dies. Films approximately 34 nm in thickness have been fabricated using atomic layer deposition in conjunction with standard surface micromachining. Bonding surfaces consist of polyimide pillars with a pitch of 19.8–29 μm that support nanofilm cantileve…

Material Characterization and Transfer of Large-Area Ultra-Thin Polydimethyls…

Abstract—Fabrication of ultra-thin (1–20-μm thickness) polydimethylsiloxane (PDMS) films is enabled with a hexane dilution process and an underlying gelatin release layer. The release and transfer of these films over large areas (>5 cm) allows measurement of the thickness-dependent and process-dependent mechanical properties of ultra-thin PDMS membranes, reported for the first time. The e…

Magnetoviscoelastic Ferrofluid-Based Magnetometer

Abstract—In this paper, we present a novel concept for magnetic sensing that is based upon the sensitive monitoring of the magnetoviscoelastic effects in magnetic nanoparticle containing ferrofluids using micromachined shear mode bulk acoustic wave quartz crystal resonators (μQCR). The unique sensor concept is based on the application of, hitherto unexplored, magnetic field induced viscoela…

Low-Temperature Wafer Bonding Using Solid–Liquid Inter-Diffusion Mechanism

Abstract—The low temperature joining of semiconductor substrates on wafer level by solid–liquid inter-diffusion bonding using the Cu/Ga and Au/In systems is investigated regarding the bonding parameters and their influence on bond interface properties. The focus is on temperature dependence and composition of interface. In the case of Cu/Ga bonding, a phase transition from CuGa2 to Cu9Ga4 …

Lead-Free (K,Na)NbO3 Impact-Induced-Oscillation Microenergy Harvester

Abstract—We developed microenergy harvesters using impact-induced oscillation to scavenge electrical power from low frequency (

Large-Area MEMS-Based Distributed Bragg Reflectors for Short-Wave and Mid-Wav…

Abstract—We present the design, fabrication, and optical characterization of silicon-air-silicon-based distributed Bragg reflectors, or quarter wavelength mirrors, in sizes ranging from 200 μm × 200 μm to 5 mm × 5 mm. Such mirrors can be used in conjunction with either single-element photodetectors or large-area focal plane arrays to realize tunable multispectral sensors or adaptive foca…

Compression-Stage-Based Differential Displacement Sensing Device

Abstract—A differential structure based on a compression stage, which has negative displacement coefficient unit (NDCU) and positive displacement coefficient unit (PDCU), is designed to improve the sensitivity of the displacement measurement. The sensing material in the compression-stage-based differential displacement sensing device is made of conductive polymer composite, which has a critic…

Capillary Flow in PDMS Cylindrical Microfluidic Channel Using 3-D Printed Mold

Abstract—This letter investigates the capillary filling in polydimethylsiloxane (PDMS) microchannels using 3-D printed molds to produce channels with circular cross sections. The circular cross sections are prevalent in biology and anatomy, yet they cannot readily be mimicked with existing soft-lithography techniques. The molds are printed directly from computer-aided design files, making rap…

Investigation of E-Beam Evaporated Silicon Film Properties for MEMS Applications

Abstract—This paper investigates the crystallinity, microstructure, surface morphology, stress characteristics, and Young’s Modulus of ultrahigh vacuum (UHV) electron-beam (E-beam) evaporated silicon films with a low thermal budget. The films are evaporated at various substrate temperatures ranging from 200 °C–625 °C, deposition rates ranging from 50 to 400 nm/min, and annealed at 600 …

Investigation of a Vacuum Encapsulated Si-to-Si Contact Microswitch Operated …

Abstract—We report on characterization of Si-to-Si contact microswitches fabricated in an ultraclean encapsulation process. This three-terminal microswitch relies on a curved beam (source) that actuates toward the contact terminal (drain) by charging the control terminal (gate). The operation range of this switch from −60 °C to 300 °C is investigated, which approximately yields a resistan…

Investigation Into the Quality Factor of Piezoelectric-on-Silica Micromachine…

Abstract—In this paper, we investigate loss mechanisms in piezoelectric-on-silica bulk acoustic wave resonators, including those resulting from thermoelastic damping (TED), surface roughness, and supporting tethers. Alternate resonator designs, piezoelectric materials, and fabrication processes are demonstrated to empirically test these loss mechanisms. Quality factors (Qs) in the order of �…

Interrogation of Droplet Configuration During Electrowetting via Impedance Sp…

Abstract—Several parameters associated with the configuration of a microliter aqueous droplet are determined by the electrical impedance measurements conducted during electrowetting. In each case, the wetted area of a dielectric-coated electrode is first determined from the impedance data, and the known dielectric thickness and permittivity. The wetted area data is then employed in a series …

Integratable Capacitive Sensor for Identification of Microfluidic Two-Phase F…

Abstract—This paper presents a feasible solution for a real-time sensing of microfluidic two-phase flow in lab-on-chip devices. A capacitive flow pattern sensor has been realized by employing an interdigital electrode configuration and a thin dielectric film. Three main flow patterns were observed in the microchannel, namely, droplet, short slug, and long slug flows. The output signal from th…

In-Plane and Out-of-Plane MEMS Gyroscopes Based on Piezoresistive NEMS Detection

Abstract—This paper presents a new design and a complete characterization of amplitude-modulation gyroscopes based on piezoresistive nanogauges. The working principle and optimization criteria of in-plane and out-of-plane devices relying on double frame decoupling and levered sense mode are discussed in light of sensitivity and resolution theoretical predictions. The architecture of driving …

In Situ Platform for Isothermal Testing of Thin-Film Mechanical Properties Us…

Abstract—An in situ tensile test platform has been developed to study the mechanical properties of thin-film metal specimens. The fully integrated on-chip platform loads a specimen using a thermal actuator (TA). TAs conveniently provide high forces and excellent alignment, but generate large heat that can flow to specimens and raise their temperature. In the new design, heat flow to the speci…

Improving Sensitivity of Resonant Sensor Systems Through Strong Mechanical Co…

Abstract—This paper reports on the first use of strongly coupled microresonators to improve the sensitivity of resonant sensing systems. To date, the research on coupled resonant sensors has concentrated on weakly coupled systems, which rely on the measurement of signal amplitudes. Strongly coupled resonant sensor systems, on the other hand, provide a frequencyshift output that results in imp…

Implementation of a CMOS-MEMS Filter Through a Mixed Electrical and Mechanica…

Abstract—We propose a novel filter coupling scheme, which combines the merits of mechanically and electrically coupled methods to enable a well-defined narrow bandwidth and a decent stopband rejection in a CMOS-MEMS bandpass filter. In the proposed design, a previously developed free–free beam arrayed resonator is employed as a basic resonant tank for the filter concept validation. By the …

Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies…

Abstract—The self-assembly of known good dies on hosting substrates using liquid surface tension is a promising technology to create highly integrated 3-D and heterogeneous microelectronic systems. In this paper, we investigate the effects of the edge structures of self-assembled chips on alignment accuracies. Nine types of 100-μm-thick Si chips (3 mm × 3 mm) with and without step geometrie…

High-Q UHF Spoke-Supported Ring Resonators

Abstract—A vibrating micromechanical spoke-supported ring resonator employing a central peg-anchor, balanced non-intrusive quarter-wavelength extensional support beams, and notched support attachments attains high Q-factor in vacuum, posting 10 000 at 441 MHz when made of polysilicon structural material and 42 900 at 2.97 GHz when made of microcrystalline diamond. The latter marks the highes…

Highly Sensitive Tactile Sensing Array Realized Using a Novel Fabrication Pro…

Abstract—This paper presents a highly sensitive tactile sensing array. Sensing elements of the array comprise multiwall carbon nanotubes and polydimethylsiloxane polymer. A novel lithography process is proposed for fabricating an SU-8 mold for shaping the sensing cells in the array. In addition, a nylon membrane filter is proposed to serve as a mold for numerous microdome patterns, which wer…

Highly Efficient Passive Thermal Micro-Actuator

Abstract—A passive thermal micro-actuator with large area specific work and large displacement, fabricated of electroplated nickel on a silicon substrate is presented. The actuation relies on the thermal expansion of beams in a V-shaped geometry. Two V-shaped beam stacks are aligned opposite to each other and are coupled to a lever transmission. The actuator exhibits low energy losses due to …

Ge/ZnS-Based Micromachined Fabry–Perot Filters for Optical MEMS in the Long…

Abstract—This paper reports on the successful demonstration of Ge/ZnS-based Fabry–Perot filters operating in the longwave infrared (LWIR). The suitability of thermally deposited Ge and ZnS as thin-film mirror materials for micromachined LWIR Fabry–Perot filters has been fully investigated, and it is shown that a film growth temperature higher than 150 °C is key to depositing durable ZnS …

Frictional Characteristics of Sub-100-μm Borosilicate Glass Balls for Actuat…

Abstract—The frictional characteristics of ∼62-μm diameter borosilicate glass balls used as rolling elements for a miniature electromagnetic linear actuator were assessed. The glass balls were placed between two silicon plates of the actuator with linear bearing tracks fabricated in the shape of V-grooves on the silicon surface. Rolling friction experiments were conducted using the electro…

Flexible Distributed Pressure Sensing Strip for a Urethral Catheter

Abstract—A multi-sensor flexible strip is developed for a urethral catheter to measure distributed pressure in a human urethra. The developed sensor strip has important clinical applications in urodynamic testing for analyzing the causes of urinary incontinence in patients. There are two major challenges in the development of the sensor. First, a highly sensitive sensor strip that is flexibl…

Fabrication of Lead-Free Piezoelectric (K, Na)NbO3 Thin Film on Nickel-Based …

Abstract—It is desirable to replace noble metals used aselectrode materials for piezoelectric thin film with base metals. A nickel-based layer is proposed as a bottom electrode for potassium (K) sodium (Na) niobate (NbO3) (KNN) piezoelectric thin film. Pure nickel is used as a bottom electrode under the KNN layer, and nickel silicide is used as an uncovered bottom electrode to gain access to…

Fabrication and Nonlinear Thermomechanical Analysis of SU8 Thermal Actuator

Abstract—SU8-based micromechanical structures are widely used as thermal actuators in the development of compliant micromanipulation tools. This paper reports the design, nonlinear thermomechanical analysis, fabrication, and thermal actuation of SU8 actuators. The thermomechanical analysis of the actuator incorporates nonlinear temperature-dependent properties of SU8 polymer to accurately mod…

Experimental Study on Etching Characteristics of a Spin-Etching Method

Abstract—In this paper, a spin-etching method is proposed for wafer thinning using a mixture of hydrofluoric, nitric, and acetic acids (HNA solution), and experimental studies are conducted. In the spin-etching apparatus, the silicon wafer was rotated in a Teflon bath filled with HNA solution. The etch rate of HNA spin-etching can be determined by mixture ratio; mass transfer, both through an…